EUTECT setzt Galvo-Scanner beim Laserlöten und dem Laser Knife zur hochgenauen Positionierung des Laserstrahls und für taktzeitoptimierte Lötergebnisse ein.
EUTECT supports you in the search for potential savings, efficiency increases and process optimization of your soldering processes.
EUTECT enables reliable processing of Innolot and avoids the formation of the so-called “nickel drop”.
EUTECT supports you in the search for potential savings, efficiency increases and process optimization of your soldering processes.
Automation solutions for the selective soldering of assemblies help to increase product quality and reduce manufacturing costs.
EUTECT manufactures the particularly low-service and low-maintenance induction pumps itself and offers them to various industries
In combination with the SWF, induction soldering becomes a highly efficient soldering process for electronics production.
There are various reasons for using customised soldering automation for selective soldering. It is often the complexity of the assembly that prevents the use of standard soldering systems.
The development of customised workpiece carriers requires careful planning and consideration of various factors to ensure that the carriers meet the customer's requirements and match the selected soldering process so that it works efficiently
New products, product adaptations and variations, new suppliers or new supplier products - the reasons for optimising selective soldering processes can be manifold, e.g. if a new supplier for printed circuit boards has been selected after several years
The customer only gets real process stability and benefits from selective soldering or soldering with mini wave and mask technology if the mask has been developed and manufactured in relation to the soldering nozzle and their joint function is therefore guaranteed
Basically, this question can be answered with YES, regardless of which cobot is involved. Then comes the big BUT and this is based on the actual character and the possible location or task of the cobot
When we use 6-axis robots from our suppliers Stäubli and Mitsubishi, we usually install them overhead in our process cells. The reason for this is simple: in order to integrate as many processes as possible in a small space in the cell, we have to utilise the space for handling the assembly or the workpiece carrier as optimally as possible
The EUTECT Machine Interface EMI is responsible for the movement in the soldering system and includes the following functions for the NCI (axes) and robot modules. Various functions are available to the operator:
Our EUTECT technical centre is equipped with all soldering process modules from our range. In the technical centre, we evaluate your product using our processes in order to achieve the goals required by you or your customer or to make them even more efficient with newly developed solutions
A process can only really be controlled if the technology knows how the process is behaving at the soldered joint during a soldering process. At EUTECT, innovative and globally unique technologies such as the EUTECT wire feeder SWF are used for this purpose, while a wide range of sensors and pyrometers are also used to collect data
All EUTECT machines and modules are supplied with a special QR code. This QR code provides access to our digital machine documentation hub, the Pink Flamingo
When it comes to selective soldering, there is no other company in Germany with so much experience. No matter what soldering task or soldering process is required, we have already realised almost everything once
As a specialist in selective soldering processes, EUTECT offers a globally unique process and system solution in combination with EUTECT control technology and EUTECT software, which is available to every system integrator as a modular system
In the context of innovation, products, services or processes are generally further developed and/or brought to a new process level through the application of new procedures or the introduction of new technologies
The MBK is Eutect's modular construction kit, which for more than 15 years has presented the entire range of modules from which we configure the machine solutions for your selective soldering processes. We have now transferred this modular system into the digital age
When developing the best possible technical implementation for soldering tasks, the product with its given design and any possible design adaptations, the desired product quality, the existing and required automation concepts in production and the process quality are at the centre of our activities
Sustainable, ecological soldering processes can be realised in various ways. Of course, the simplest option is to optimise the overall process in terms of energy requirements alone so that it consumes as little electricity as possible
Fluxes, such as those from our partner Emil Otto, are an essential part of a soldering process. The application of flux, as an independent process, therefore requires just as much expertise as the subsequent soldering process
With specific selective soldering processes from Eutect, coated enamelled copper wires can be thermally soldered in a single step and without additional removal of the insulation. The core expertise in lead-free processing of characteristic solder alloys forms the specific process knowledge
Batch sizes of 1 or small quantities pose challenges for every process, because the established series production has to be interrupted in a time-consuming manner. New ideas and concepts are therefore necessary
Soldering with solder wire always requires two consecutive processes: the feeding of the solder wire and the melting due to the heat input. It is not possible to carry out both processes simultaneously
Compared to conventional thermode soldering, the Laser Knife offers a significantly higher process speed and energy efficiency. Thanks to the non-contact soldering process with a laser beam, we achieve up to 10 times the speed of thermode soldering and reduce the energy requirement by 70%.
To be clear from the outset, this topic is purely theoretical. The facts listed here are achievable when working in a perfect production environment, with pre-products without tolerances etc.
A flawless solder pattern is essential for a clean, reproducible laser soldering process. Solder balls during the soldering process must be avoided at all costs, as they can cause short circuits on the assembly or non-reproducible solder quantity input
Each preheating process must be checked physico-chemically in holistic coordination with the neighbouring components, soldering surfaces, heat sinks, solder penetration and quality requirements for the process sequence, as each heating process can trigger an additional ageing process for the assembly to be processed
When it comes to burns during laser soldering, there are many factors and influences to consider, from positioning, selecting the right focus diameter, the optimum solder wire and the process surfaces of the joining partners, through to other influencing variables
What measures minimise the risk of desoldering SMD components? What do you need to consider when using a solder mask? What types of solder mask are available?
What options do you have to support your soldering process? Mini wave or selective soldering and laser soldering
Do you have to deal with the tangled wires in your piston, induction or laser soldering automation on a daily basis? Is your soldering process using solder wire feed inaccurate, not reproducible or do you have so-called "antenna soldering"?
Do solder beads form during your selective or wave soldering process? Are you applying the right amount of flux? Are you preheating your product to activate the flux?
One reason may be that the solder pin, including the solder pin housing environment, seals the hole in which it is inserted tightly from above and thus prevents the air from escaping upwards from the solder joint. In this case, it may be that the hole diameter for the pin is too narrow and that it needs to be adjusted during a design review
The devil is often in the detail when it comes to precise fluxing. If you adjust the flux application that applies the flux to the circuit board, you can control the result quite precisely, even if the flux is applied very quickly
Processed components (SMD/THT?), number of assemblies and solder joints, cycle times, PCB design and number of profile changes and, finally, the budget. These parameters are checked in an evaluation that takes place in the EUTECT technical centre
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