With specific selective soldering processes from Eutect, coated enamelled copper wires can be thermally soldered in a single step and without additional removal of the insulation. The core expertise in lead-free processing of characteristic solder alloys forms the specific process knowledge. For example, Eutect has developed High-temperature soldering modules which can be used at temperatures of up to 480 °C and work reliably with static or flowing molten solder. In order to achieve a high tinning quality of the enamelled copper wires despite copper alloys or leaching, the stripping process is defined in a process-friendly and product-specific manner via the static or flowing solder melt and the exact temperature time curve. Solders with additional alloys also counteract various negative effects, for example by reducing wire deposition, solder oxide formation and solder contamination and protecting the soldering system.
The high-temperature tinning process can be carried out using a static solder bath or a dynamic, freely programmable doctor blade system. This allows contamination to be reduced and the base alloy of the solder to be retained in its original composition throughout the entire process. The controlled removal of contaminated solder and the automatic refilling of base solder remains constant throughout the entire production process. In order to achieve a clean enamel demarcation between the tinned wire and the poly insulation, the wire ends can be moved kinematically during the dipping movement in both the static and the flowing solder wave and, if necessary, cleanly demarcated with appropriate masking.
Surfaces that come into contact with hot solder are completely protected by special coatings, both in the static and in the flowing solder. Furthermore, an induction solder pump that is free of moving parts was developed for this area of application. The high-temperature soldering system is equipped with specially programmed algorithms, with associated process control and redundant monitoring of the soldering melt temperature. It has a nitrogen shielding gas bell, height-adjustable solder waves and an input HMI above the soldering process surface. The system also allows process data to be recorded and tracked.