Cycle time optimised mini wave soldering
EUTECT mini wave soldering is characterised by the single-sided, non-wettable nozzle technology in combination with the horizontally installed, inductive pump technology. The interaction of customised nozzle, mask and workpiece carriers ensures the most stable and efficient soldering process.
Benefit
The selective solder wave guarantees a soldering process free of oxides and residues thanks to the inert gas atmosphere. Thanks to the continuously pumped solder wave, the heat transfer from the molten solder is transferred homogeneously to the solder joint geometry. The flowing solder wave cleans the solder joint of excess flux residue, oxides and dirt.
Performance
The solder joint is physically self-adjusting due to the capillary filling level solder saturation. The optimum solder geometry is reliably mapped to the pad pin mould, pin hole position and thermal mass distribution in the PCB structure. Solder crossings, menisci and intermetallic phase characteristics round off the overall performance in a reproducible manner.
Modularity
The modular solder tank sizes together with the electromagnetic solder pump system and the quick-change solder nozzles form the basic process module. The redundant temperature control, the constant solder bath level, the optional solder wave height control and the continuous solder wire tracking guarantee maximum system autonomy.
Product highlights
- Highest solder joint quality
- 100% Traceability
- Minimised waste
- Minimised solder consumption
- Minimised service costs
- Maximum service accessibility
- Maximum system autonomy
- High process reliability
- Minimal footprint
- Highest connection quality
- Maximum service life
- Nitrogen environment
- Reproducible solder flow
- Consistent process stability
- Horizontally installed induction pump
- Customised solder nozzle geometry
- Customised print mask technology
- Maintenance-reducing surface coatings
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