Mini wave soldering

Cycle time optimised mini wave soldering

EUTECT’s mini wave soldering system is characterised by the single-sided, non-wettable nozzle technology in combination with the horizontally installed, inductive pump technology. The interaction of customised nozzle, mask and workpiece carriers ensures the most stable and efficient soldering process.

Benefit

The selective solder wave presented at Coiltech guarantees a soldering process free of oxides and residues thanks to the inert gas atmosphere. The solder wave, which is continuously pumped by an induction pump, transfers the heat transfer from the molten solder homogeneously and circumferentially to the solder joint geometry. The flowing solder wave cleans the solder joint of excess flux residue, oxides and dirt.

Performance

The solder joint is physically self-adjusting due to the capillary filling level solder saturation. The optimum solder geometry is reliably mapped to the pad pin mould, pin hole position and thermal mass distribution in the PCB structure. Solder crossings, menisci and intermetallic phase characteristics round off the overall performance in a reproducible manner.

Modularity

The modular solder tank sizes together with the electromagnetic solder pump system and the quick-change solder nozzles form the basic process module. The redundant temperature control, the constant solder bath level, the optional solder wave height control and the continuous solder wire tracking guarantee maximum system autonomy.

Product highlights

Highest solder joint quality
100% traceability
Minimised waste
Minimized solder consumption
Minimised service costs
Maximum service accessibility
Maximum system autonomy
High process reliability
Minimal footprint
Highest connection quality
Maximum service life
Nitrogen environment
Reproducible solder flow
Consistent process stability
Horizontally installed induction pump
Customised solder nozzle geometry
Customised print mask technology
Maintenance-reducing surface coatings

Product video

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Why EUTECT?

EUTECT GmbH is an innovative company specializing in the development and production of high-quality soldering systems. Founded in Germany, we have made a name for ourselves as a leading provider of customized, selective soldering technologies and solutions. Our portfolio includes a wide range of selective soldering processes and automation solutions that are suitable for a wide variety of industrial applications.

Our outstanding feature is our ability to develop customized solutions that are precisely tailored to the specific requirements of our customers. By utilizing state-of-the-art technologies and with a deep understanding of the specific challenges of electronics manufacturing, we offer innovative approaches that ensure high process reliability and efficiency.

Through continuous research and development, we help to ensure that soldering processes are technically advanced and integrate the concept of sustainability into our processes. In doing so, we take into account state-of-the-art approaches such as the cradle-to-cradle concept in order to minimize our ecological footprint. In addition, we are characterized by excellent customer service, which is based on close cooperation with customers and comprehensive support throughout the entire product life cycle.