Clean and reliable stripping and tinning of enamelled copper wires
Enameled copper wire technology is a core process in the production of current and future mobility requirements.
Benefit
With conventional soldering technology, enamelled copper wires coated with polyurethane or polyesterimide cannot be processed without oxide formation and insulation residues on the wire and in the soldering module. To prevent this, Eutect has developed an innovative process.
E-mobility components
Today's e-mobility concepts require a large number of switching and transformation components, coilformers, magnetic heads, sensors, relays and other electronic components that also require enamelled copper wire technology for their production. Enamelled wire manufacturers are constantly developing new products to meet these diverse requirements. These are provided with a wide variety of insulation materials, some of which are also newly developed, in order to improve the insulation class and thermal resistance for future end products.
Performance
Eutect's modular system includes selective soldering processes that allow coated enamelled copper wires to be stripped and tinned thermally and reliably in a single step without additional removal of the insulation. Lead-free processing with all its characteristic process finesse in relation to the specific solder alloy, the flux and the temperature-time curve with flowing or standing molten solder is the overarching core expertise of target-oriented process processing. Eutect has developed soldering systems that reach temperatures of up to 475 °C. These systems work with a flowing solder wave that reliably removes any remaining insulation residue from the tinning point. Complete nitrogen gassing of the solder wave also ensures permanent oxide-free tinning.
Product highlights
- Flowing molten solder for tinning without insulation residue
- Gentle and product-specific stripping of wire insulation
- Process-safe tinning of copper wires
- Horizontally installed induction pump prevents direct deposition of solder residue in the induction pump.
- Minimal solder oxide formation
- Protection through appropriate masking options
- Avoidance of black dots
EN 
DE