For a clean, reproducible Laser soldering process a perfect solder pattern is essential. Solder balls during the soldering process must be avoided at all costs, as they can cause short circuits on the assembly or non-reproducible solder quantities. Particularly with tight packing densities, care must be taken to ensure that the soldering process is as precise as possible. If solder balls nevertheless occur, they must be prevented. Please note the following points:
Have you selected the correct angle between the solder wire and the laser incidence angle?
If not, readjust the angle.
Can unwanted reflections be caused by product or laser head positioning?
Wenn dem so ist, sollte der komplette Aufbau des Lotprozesses überdacht werden. Kann der Aufbau nicht angepasst werden, so sollte überlegt werden, ob Reflektionen durch Abdeckungen oder Masken verhindert werden können.
Are your positioning and wire feed lengths correct? Are you using the correct wire speeds during feeding, during the process and during wire retraction?
If not, adjust the speed to avoid the formation of balls. Particularly important here is the wire retraction, which guarantees a reproducible process. Read more about the Sensitive Wire Feeder (SWF) from EUTECT.
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