The customer gets real process stability and benefits from selective soldering or soldering with Mini wave and mask technology only once the mask has been developed and manufactured in relation to the solder nozzle and thus their joint function is guaranteed. Increasingly complex assemblies due to miniaturisation or difficult-to-access and sensitive geometries require new solutions. EUTECT has developed these over the last 25 years and successfully installed them in production lines.
Special solder nozzle/mask combinations made from composite materials often reach the limits of what is technically feasible. For example, if circuit boards are already mounted in a housing and SMD components on the underside are very close to the housing and the THT solder joints to be soldered, the walls, intermediate webs and connections must be very thin. As the metal bars still need to be stable in the long term, we manufacture all masks from titanium.
Titanium is the material of choice, especially for bar widths of well under 1 mm and the required durability. Thanks to its high strength, it is possible to produce a bar width of less than 0.5 mm. But titanium offers even more advantages. The metal is very durable and resistant to fluxes, aggressive cleaning substrates and other chemical influences. Due to the temperatures achieved by EUTECT in the soldering processes and the high process throughputs, the EUTECT solder masks are manufactured as full titanium masks.
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