Innovative soldering technology with Innolot: Avoiding ‘nickel drop’
When using Innolot for selective soldering, particular attention must be paid to preventing the formation of what is known as “nickel drop”. A “nickel drop” refers to the phenomenon that occurs during the soldering process, known as intermetallic precipitation or deposits of nickel. These result from chemical and physical interactions between the materials involved, the solder alloy and the surfaces, e.g. of components or PCBs. This leads to inhomogeneous solder joints, which can impair the mechanical and electrical properties of the connections.
The “nickel drop” can occur as a result of an unsuitable combination of product design, heat management and surface selection, as well as the use of poor-quality materials. However, the main reason is incorrect process sequences and/or parameters.
EUTECT - Pioneer in high-temperature soldering technology
In 1989, EUTECT built the first mechanically pumped high-temperature mini-wave soldering modules with a soldering temperature of up to 550 °C. Even then, special, in-house developed coatings and materials were used for tanks, nozzles and other components. These innovative approaches prevent intermetallic precipitation and ensure a high process quality. Particularly remarkable is the fact that EUTECT almost solely uses non-wettable solder nozzles that cannot be discarded. Thanks to these nozzles, the special coatings and materials, and a professional and regularly performed service (10 minutes a day or 35 minutes a week), EUTECT customers are not experiencing any known alloying problems or intermetallic precipitates at soldering process temperatures of up to 350°C. These customers include, for example, renowned tier-1 suppliers to the automotive industry.
Continuous Innovation for optimal soldering processes
About 15 years ago, EUTECT also developed a selective mini-wave soldering module with horizontally installed induction pumps. This innovation ensures a reduction of deposits and impurities in the pump, provides optimal pump performance and makes servicing considerably easier. To meet the additional specific requirements of modern solder alloys such as Innolot, EUTECT has also developed a customized solder tank and pump control concept for almost 10 years. This makes it possible to switch the crucible on and off flexibly or to put it into standby mode. This reduces the stress on the components as well as the consumption of nitrogen, solder and energy to a minimum.
Reliability under extreme conditions
The performance of the EUTECT mini-wave soldering modules is impressive. In the standard version, soldering temperatures of up to 350°C can be processed, optionally even up to 480°C. Mechanically pumped modules are designed for temperatures up to 550°C. EUTECT nozzles are also designed for use at temperatures up to 550°C, which underlines their durability and reliability even under extreme conditions.
With these technological innovations, EUTECT is setting standards in selective soldering technology and enabling its customers in industries such as automotive, aerospace and industrial electronics to carry out reliable and highly precise soldering processes using Innolot.
Innolot is based on the standardized lead-free alloy SAC305, which consists of tin (Sn), silver (Ag) and copper (Cu). However, the alloy also contains other elements that significantly improve its properties. Bismuth (Bi) lowers the melting temperature and simultaneously increases the strength of the soldered joints. Antimony (Sb) helps to improve creep strength and mechanical stability, which increases reliability under high stress. Nickel (Ni) ensures increased oxidation resistance and improves intermetallic formation, further optimizing the quality and durability of soldered joints. These additives make Innolot particularly suitable for applications that are subject to high thermal and mechanical stresses.
Contact us, we will help you to optimize your soldering process.
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