Selective soldering processes from Eutect allow coated enamelled copper wires to be thermally soldered in a single step without additional removal of the insulation. EUTECT has developed high-temperature soldering modules for this purpose, which can be used at temperatures of up to 480 °C and work reliably with static or flowing solder melt. In order to achieve a high tin-plating quality of the enamelled copper wires, despite copper alloys or leaching, the stripping is defined via the static or flowing solder melt and the exact temperature time curve in a process-friendly and product-specific manner. In addition, solders with additional alloys counteract various negative effects, for example by reducing wire alloying, solder oxide formation and solder contamination and protecting the soldering system.