The EUTECT Miniwave Soldering technique follows the laws of physics and thereby ensures the most stable and efficient selective soldering process.
With the inert gas atmosphere, the selective solder wave guarantees a soldering process carried out free of oxides and residues. Due to the continuously pumped solder wave, the heat from the molten solder is transferred homogeneously all around to the solder joint geometry. The flowing solder wave thereby cleans the solder joint of surplus flux residues, oxides and contaminants.
Together with the electromagnetic solder pump system and the quick-change soldering nozzles, the modular solder tanks of various sizes form the basic module of the process. The redundant temperature control, the constant solder bath level, the optional solder wave height control and the continuous solder wire tracking guarantee maximum system autonomy.
Due to the capillary filling level solder satiation, the solder joint is distinctly physically self-setting. The optimal solder geometry is thereby shown process-reliable by Pad-Pin form, Pin-Hole position and thermal mass distributions in the circuit board structure. Solder step-throughs, menisci and intermetallic phase characteristics reproducibly round off the overall performance.
EUTECT Ring nozzles for optimal cycle times
EUTECT Point nozzles for maximum service life and optimal energy input
High temperature soldering
Selective soldering processes from Eutect allow coated enamelled copper wires to be thermally soldered in a single step without additional removal of the insulation. EUTECT has developed high-temperature soldering modules for this purpose, which can be used at temperatures of up to 480 °C and work reliably with static or flowing solder melt. In order to achieve a high tin-plating quality of the enamelled copper wires, despite copper alloys or leaching, the stripping is defined via the static or flowing solder melt and the exact temperature time curve in a process-friendly and product-specific manner. In addition, solders with additional alloys counteract various negative effects, for example by reducing wire alloying, solder oxide formation and solder contamination and protecting the soldering system.
EUTECT Selective copper wire soldering
The EUTECT Diode Laser Soldering system ranges from single beam- to galvo optics with 25 to 1500 Watt power.
Laser soldering enables fast and non-contact energy input.
With the help of an integrated pyrometer it is possible to regulate the laser power via the process surface temperature. Solder wires, soldering pastes, preforms and other connecting materials can be processed. Diverse optics and galvoscanner techniques enable the processing of a wide variety of geometries.
Engraved vernier gauges and gauge block stops guarantee a solid reproducibility. With the EUTECT Software-Family (SoFa) new standards are set when it comes to process reliability, quality and process transparency. With the help of the EMI, temperature- resp. process profiles as well as parameters can be easily input and visualised.
High End laser optics with integrated camera, pyrometer and Air knife
SWF-LL soldering module: 100% traceability due to high speed control technology
With the temperature- and force control, the EUTECT Induction Soldering system provides a high level of process reliability.
Induction soldering is used for processing conductive materials, in order to heat them quickly and without contact. The output is thereby adapted to the product as well as the hard- or soft soldering.
Customer-specific soldering applications can be implemented through the combination with different wire-feed and dispenser modules. Soldering pastes and preforms can also be processed.
Induction soldering is distinguished by an optimal heat input. The combination with the SWF-controlled solder wire feed and pyrometric managed temperature control provides a fast and controlled process management.
Product-specific induction external circuits
Efficient, inductive preheating
The EUTECT Piston Soldering system is the only piston soldering system in the world with controlled wire feed.
The combination of the motor-driven and spring-loaded soldering tip feed with the SWF module provides a wide process- and application window.
The flexible SWF system adapter enables a solid and reproducible integration of soldering irons from a variety of manufacturers.
With piston soldering, operating data, such as the actual amount of wire inserted, the real actual temperature at the soldering tip as well as control diagrams, can be read out and visualised for quality control.
SWF-KL: Controlled piston soldering module with nitrogen
SWF-KL Controlled piston soldering module
As the only system in the world, the EUTECT Thermode Soldering system has a definable, µ-precise penetration.
The Thermode Soldering process is used for processing flexible foils, cable strands and ribbon cables as well as specific SMD components. It is distinguished by the high quality of the result as well as reproducibility.
The modular thermode soldering system can be integrated in stand-alone or inline processes. The application-specific thermode geometries are protected by automatic Kapton feeds and the process is kept stable.
Force, repositioning path and temperature are controlled, visualised and recorded via an HMI control unit. As a result, the entire process performance has the best possible availability and traceability.
Controlled flexible foil soldering with product-specific thermode head
Integrated thermode soldering module with automatic Kapton roller
Due to its energy balance, geometry independence and process performance, the EUTECT Laser Knife is one of the most resource-efficient soldering processes.
The Laser Knife can be used independently and is extremely fast with a high degree of process reliability.
The Laser Knife can be expanded for even more dynamic and cycle-time optimised soldering processes with galvo optics and X-fold knives. The temperature-controlled laser is equipped with an integrated pyrometer and a camera and guarantees the user maximum process stability, quality and traceability.
The Laser Knife consists of one and/or multiple path- and force monitored hold-down devices and a specific laser lens. The components to be soldered are joined together in a defined manner with the help of the knife. The temperature input therefore takes place without contact via the laser beam. The process module distinguishes itself through a minimal amount of servicing and maintenance work as well as the least possible requirement for replacement- and wearing parts.