EUTECT-Connecting technology

It is the assignment that determines the choice of the optimal connection, automation and software module. This is why we offer a comprehensive, constantly developing module toolbox.

Modular soldering technology

From our process modules of the modular soldering technique, the optimal modules with regard to process technology and efficiency are selected for the task and combined to proven stand-alone, rotary transfer or inline production concepts for total solutions.

The EUTECT module toolbox shows, that with individual modules or free combinations a lean, individual solution of proven modules can often be achieved for the task of a customer product.

Miniwave soldering

  • Maximum solder joint quality
  • Minimal scrap
  • Minimal solder consumption
  • Maximum system autonomy
  • High process reliability
  • Minimum footprint
  • 100% traceability
  • Maximum connection quality
  • Maximum service life
  • Minimal service work
  • Nitrogen environment (optional)
  • Reproducible solder flow
  • Freely definable solder flow
  • Constant process stability

EUTECT – Miniwave soldering

Miniwave soldering module IW1 with laser height detection

IW1-2 Dual soldering module

Noozle technology

  • Individual nozzle geometries
  • Long service life
  • Optimal cycle time
  • Maximum solder joint quality
  • Flexible nozzle technique
  • Pressure mask technique
  • Flexible nitrogen mask technique
  • Low maintenance
  • Integrated nitrogen supply
  • Definable solder reflux
  • Constant, laminar solder flow
  • Minimised risk of solder beads
  • Maximum solder nozzle geometry (90 mm height, 140 mm width)

EUTECT – Nozzle technology

Double point nozzle

Line nozzle

Induction pump

  • 80% less requirement for replacement parts
  • 50% less service- and maintenance work
  • Minimal installation space
  • Long service life
  • Magnetic induction pump
  • Soldering speed up to 8 mm/sec
  • No rotating parts in solder
  • High-temperature soldering up to 450°C soldering temperature
  • Flow
  • 400 and 800 Watt output

EUTECT Induction pump

Laser soldering

  • High level of flexibility
  • Short setup times
  • Maximum energy efficiency
  • Minimal solder consumption
  • Minimal requirement for replacement parts
  • Low maintenance work
  • Minimum footprint
  • 100% traceability
  • Maximum service life
  • Minimal service work
  • Freely definable energy input
  • Non-contact energy input
  • Immediate system- and process availability

Diode laser

Laser soldering with SWF wire feed

Induction soldering

  • Energy efficient
  • Minimal solder consumption
  • Low maintenance work
  • Minimum footprint
  • 100% traceability
  • Maximum service life
  • Freely definable energy input
  • Non-contact energy input
  • Immediate system- and process availability
  • Fast temperature input

Product-specific induction external circuits

Efficient, inductive preheating

Piston soldering

  • Short setup times
  • Minimum footprint
  • 100% traceability (optional)
  • Product-specific soldering tips
  • Immediate system- and process availability
  • Freely-definable soldering iron feed
  • Automatic soldering tip change

SWF-KL Controlled piston soldering module with nitrogen

Thermode soldering

  • High energy efficiency
  • Short setup times
  • Cycle time optimisation of up to 70%
  • Minimal solder consumption
  • Low maintenance work
  • Minimum footprint
  • 100% traceability
  • Specific thermode geometries
  • µ-precise penetration
  • Penetration control 1µm
  • Contact force is indicated in steps of 0.5 N
  • Temperature-Force-Distance Control
  • Contact pressure of 1-60 N
  • Fast heat input
  • Fast, integrated cooling
  • Redundant temperature measurement
  • Maximum service life
  • Freely definable energy input
  • Immediate system- and process availability
  • Thermode supply through intelligent linear axes
  • Up to 600A power
  • Leading and lagging hold-down device
  • Minimal installation space
  • Integrated Kapton roller

Soldering a thermode module Ribbon cable

Thermode module

Laser Knife

  • Dynamic/cycle-time optimised soldering process
  • Maximum process stability
  • Maximum energy- and resource efficiency
  • Can be used independently
  • High process speed
  • Short setup times
  • Minimal solder consumption
  • Minimal service- and maintenance work
  • Low requirement for replacement- and wearing parts
  • Minimum footprint
  • 100% traceability
  • Maximum process reliability
  • Specific laser knife geometries
  • µ-precise penetration
  • Penetration control/-regulation 1µm
  • Contact force can be regulated with 0.5 N
  • Temperature-Force-Distance Control
  • Fast heat input
  • Fast, integrated cooling
  • Redundant temperature measurement
  • Maximum service life
  • Freely definable energy input
  • Immediate system- and process availability

Laser Knife detail view

Laser Knife machine integration

Laser Knife detail view

Wire feeds

Besides non-regulated wire feeders for diverse wire thicknesses, EUTECT also offers the only force-controlled wire feeder in the world: the Sensitive Wire Feeder (SWF).

Sensitive Wire Feeder (SWF)

  • High reproducibility
  • Scope of application for laser-, induction– or piston soldering and build-up welding
  • Sensitive and fast regulation of the feed force
  • Minimal maintenance- and service work
  • Flexible integration options
  • Compact control unit EcoGerD
  • Only force-controlled wire feeder in the world
  • Speed up to 200mm/sec.
  • Easy adaptation to different wire thicknesses (0.1-2.0 mm)
  • Integrated inclination sensors (optional)
  • Visualisation of all parameters
  • 100% traceability
  • Can be freely parameterised

Sensitive wire feeder (SWF)

Sensitive wire feeder (SWF)

Workpiece carrier & Mask technology

For transport and protection of assemblies within the plant, workpiece carriers (WC) and soldering masks are used. These are developed individually for the assembly to be processed.

Workpiece carrier (WC)

  • Satellite workpiece carriers
  • Highly flexible function WCs
  • Weight-reduced WCs
  • Application of smaller robots
  • Reduced footprint of the machine cell
  • Considerable cost reduction
  • Reduced maintenance work
  • Integrated hold-down function
  • Assembly-specific WCs
  • Easy WC-change
  • Integrated placement inspections (optional)

Product-specific workpiece carrier

Mask technology

  • Optimal cycle time
  • Maximum service life
  • Reduced maintenance work
  • Reduced cleaning work
  • Maximum solder joint quality
  • Maximum component protection against heat and flux
  • Pressure mask technology
  • Integrated component placement support
  • Exact component positioning
  • Integrated inquiry intelligence
  • Maximising of the process window
  • Integrated heating function
  • Miniaturisation and functionality with titanium inserts

EUTECT mask technology for wave soldering

Fluxing

  • Freely integrable and expandable flux modules
  • Highly precise inject fluxing
  • Splash-free brush fluxing
  • Area efficient spray fluxing
  • Cycle-time optimised lift/dip fluxing
  • Lasting flux treatment
  • Reproducible flux monitoring
  • Quantity- and position-monitored inject fluxing

Brush fluxing module

Preheating / Cooling

  • Freely integrable and expandable preheating and cooling modules
  • Exact temperature processes due to tunnel systems
  • Pyrometer-controlled heat input
  • Homogeneous heat input due to blower heating
  • Highly dynamic heat input due to quartz radiators and IR heaters
  • Heat-protection masks for sensitive assembly areas

Preheating/Cooling

Brushes

  • Cleaning of circuit boards
  • Low maintenance
  • Fast exchange of brush heads
  • Durable, stable brush rotation
  • Wearing part monitoring
  • Integrated extraction
  • No static charging
  • Speed coordination to circuit board and components
  • Defined brush height to circuit board
  • Integrated height monitoring
  • Round brush
  • Fastening with thread
  • DC-Motor with fixed speed
  • Catch container for dirt particles
  • Integrated ionising unit with discharge head

Brush module with ionising unit

Inspection

  • Ensuring maximum quality demands
  • Fault-free quality control
  • Cost-reduced monitoring
  • Constant process speed
  • Constant footprint
  • Integrated solder joint inspection
  • Fully automatic inspection process
  • Integration of AOI systems
  • Manufacturer-independent

3D AOI Inspection