Soldering process can only be reproduced if individual process parameters and steps are controlled, monitored and documented. EUTECT has developed a large number of these controlled process steps in order to guarantee the traceability of the individual steps within the soldering process at all times.
Below are some examples of controlled EUTECT process solutions:
Temperature, force- and path-contolled thermode soldering
µ – precise penetration depth and °-exact temperature and 0.1N exact force control
Force and path controlled Sensitive Wire Feeder (SWF)
µ – precise path, 1.5N precise force control and 0.05mm precise wire feed
Temperature, force- and path-controlled Laser Knife
µ – precise penetration depth and °-exact temperature and 0.1N exact force control
Preheating, induction and laser modules
Heat input is pyrometer controlled
Flux Modules
Dispensing of flux using flux beam recording for quantity and position control (flux start query)
Brush module
Height-regulated brush monitoring for early wear detection
IW 1 & 2 mini wave module
Height controlled mini waves
Nitrogen soldering
Monitored and regulated nitrogen supply
Monitored and regulated nitrogen supply
Prevents overheating of the solder bath and thus defects on heaters and integrated electronics.
Barcode, RFID and specific reading and writing devices
Standard machine equipment
Suction monitoring by means of flow sensor technology
Flow is measured and the system is only started when the suction is functioning
Application of flux
Checking the flux application by using flux density control (two chamber system)
