Selective soldering processes from Eutect allow coated enamelled copper wires to be thermally soldered in a single step without additional removal of the insulation. EUTECT has developed high-temperature soldering modules for this purpose, which can be used at temperatures of up to 480 °C and work reliably with static or flowing solder melt. In order to achieve a high tin-plating quality of the enamelled copper wires, despite copper alloys or leaching, the stripping is defined via the static or flowing solder melt and the exact temperature time curve in a process-friendly and product-specific manner. In addition, solders with additional alloys counteract various negative effects, for example by reducing wire alloying, solder oxide formation and solder contamination and protecting the soldering system.
EUTECT Selective copper wire soldering
