What temperatures can be reached in high temperature soldering and where are they used?

With specific selective soldering processes from Eutect, coated enamelled copper wires can be thermally stripped in one step and without additional removal of the insulation. The core know-how of lead-free processing of characteristic solder alloys forms the specific process knowledge. For this purpose, Eutect has developed high-temperature soldering modules that can be used at temperatures of up to 480 °C and work reliably with static or flowing solder melt. In order to achieve a high tin-plating quality of the enamelled copper wires, despite copper alloys or leaching, the stripping is defined in a process-friendly and product-specific manner via the static or flowing solder melt and the exact temperature time curve. In addition, solders with additional alloys counteract various negative effects, for example by reducing wire alloying, solder oxide formation and solder contamination and protecting the soldering system.

The high-temperature process for tinning can be carried out with both a static solder bath and a dynamic, freely programmable squeegee system. In this way, contamination can be reduced and the base alloy of the solder can be maintained in its original composition throughout the entire process. The controlled removal of contaminated solder and the automatic refilling of base solder remains constant throughout the entire production process. In order to achieve a clean lacquer demarcation between the tinned wire and the poly-insulation, the wire ends can be moved kinematically in both the static and the flowing solder wave during the exchange movement and, if necessary, cleanly demarcated with appropriate masking.

Surfaces that come into contact with hot solder are completely protected by special coatings, both in the static and in the flowing solder melt. Furthermore, an induction solder pump was developed for this application, which is free of moving parts. The high-temperature soldering system is equipped with specially programmed algorithms, with associated process control and redundant monitoring of the solder melting temperature. It features a nitrogen shielding gas bell, height-adjustable solder waves and an input HMI above the solder process surface. The system also allows process data to be recorded and tracked.

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