EUTECT Lösungskompetenz

Tag: swf-en

Do you have solder ball formations on the wire or the solder joint when laser soldering?

For a clean, reproducible laser soldering process, a perfect solder pattern is essential. Solder ball formation during the soldering process must be avoided at all costs, as they can cause short circuits on the assembly or the amount of solder applied is not reproducible. Particularly in the case of tight packaging densities, it is essential to ensure that the soldering process is as precise as possible. If solder balls occur nevertheless, they must be eliminated. Please consider the following points:

Have you chosen the correct angle between solder wire and the angle of incidence of the laser?

If not, readjust the angle.

Can unwanted reflections be caused by product or laser head positioning?

If so, the complete structure of the soldering process should be considered. If the setup cannot be adjusted, you should consider whether reflections can be prevented by covers or masks.

Are your positioning and the conveying the lengths of the wire correctly? Do you use the correct wire speeds when feeding, during the process and during wire withdrawal?

If not, adjust the speed to avoid the formation of balls. Wire withdrawal is particularly important here, as it guarantees a reproducible process. Read more about the SWF from EUTECT.

Wire bend? Problems with piston or laser soldering?

Are you busy troubleshooting the wiring clutter in your piston, induction or laser soldering automation daily?

Is your soldering process inaccurate due to wire feed, not reproducible or do you solder “antennas”?

Try to align your energy source, does not matter if soldering iron, induction outer circuit or laser focus, in such a way that the energy acts on the one hand in the joint partner with the highest heatsink and on the other hand in the solder wire. This allows a faster fusing of the solder wire and thus a thermal bridge between the connected partners and therefore allows for a better solder joint formation.

Please note the adjustable feed, process and withdrawal speeds of the solder wire, these three variables offer significant optimization possibilities.

If this does not help or if you want to optimize your takt time and intermetallic phase further, try pre-tinning the joints and then feed them into the soldering process with filler wire, paste or preform.

Would you like to know what your wire feed really did in the soldering process?

If you want to get data regarding your soldering process to know exactly what happens during the soldering process, we recommend you contact us regarding our SWF wire feed module – it’s worth it – it’s the world’s only “actio-reactio” based and power controlled wire feed in the world.

More about the EUTECT SWF Module

As there are many different solder wire applications worldwide, there are also many different challenges for which we have developed our own solutions. Contact us and we will help you to optimize your soldering process.