Solution competence

Why does EUTECT use induction pumps in mini-wave soldering processes?

Induction pumps use electromagnetic induction to set conductive liquids such as liquid metal in motion. The pumps use the principles of electromagnetics to create a flow. Since no moving mechanical parts are required, wear is reduced, and the risk of leaks is minimized. Mechanical components do not come into direct contact with the liquid, which significantly reduces the pumps' susceptibility to corrosion and mechanical wear. The induction pumps are particularly suitable for liquid metals that have to withstand extreme temperatures and high chemical reactivity and are therefore ideal for pumping solder during mini wave soldering in selective soldering processes.

EUTECT process technology

Selective soldering

Innovative, selective soldering processes for complex assembly production

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Matrixduese

Mini wave soldering

Das EUTECT Miniwellenlöten zeichnet sich durch die einseitig ablaufende, nicht benetzbare Düsentechnologie in Kombination mit der horizontal eingebauten, induktiven Pumpentechnologie aus.

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Since the EUTECT induction pumps are installed transversely, they require very little servicing and maintenance. As a result, significantly less abraded material and dirt from the soldering joints collect in the tubes of the induction pump. EUTECT induction pumps also work reliably in high temperature ranges of up to 475°C and are therefore also used for Enamelled copper wire soldering . Here they ensure a constant solder flow to the solder nozzle into which the copper wires are dipped.

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