Solution competence

What solutions does EUTECT offer for clean and reliable stripping and tinning of enamelled copper wires?

Modern e-mobility applications are based on a wide range of electrical and magnetic components, from switching and transformation components, coilformers and magnetic heads to sensors, relays and other electronic assemblies. The processing of enamelled copper wire is a key component in their production. Enamelled wire manufacturers are constantly developing new wire types with innovative insulation systems in order to meet the ever-increasing demands on performance, efficiency and temperature resistance. These ensure higher insulation classes and improved thermal resistance in future end products.

Within its modular system concept, EUTECT offers selective soldering processes with which coated enamelled copper wires can be reliably thermally stripped and tinned in a single process step, without any upstream mechanical or chemical removal of the insulation. Lead-free processing is at the centre of the process expertise. The precise coordination of solder alloy, flux and temperature-time profile with continuously flowing molten solder is crucial.

For these demanding applications, EUTECT has developed special soldering systems that reach temperatures of up to 475 °C. The inserted solder wave is generated by an induction pump and safely removes any remaining insulation residue at the tinning point, while complete nitrogen gassing ensures a permanently oxide-free and high-quality tinning process.

Would you like to find out more about the clean and reliable stripping and tinning of enamelled copper wires? Then visit us at the Coiltech Germany 2026 from 25-26 March 2026 in Augsburg, Stand 2-A17.

Workpiece carrier

Workpiece carrier and mask technology

Product-specific workpiece carriers and mask technologies protect assemblies during transport and processing. EUTECT develops them individually tailored to each assembly and each soldering process for precise and stable results.

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Duesen technology

Nozzle geometries

Individual, product-specific solder nozzles are a key component of the EUTECT mini-waves and guarantee reliable and cycle time-optimised solder wetting of the components and substrates to be soldered.

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Matrixduese

Mini wave soldering

EUTECT mini wave soldering is characterised by the one-sided, non-wettable nozzle technology in combination with the horizontally installed, inductive pump technology.

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