Thanks to preheating, the possible material stress that can affect the PCB and the components already placed due to the heat input is minimised. This has a direct influence on the through-hole plating and the counterminiscus of the solder joint, thereby optimising the soldering quality and cycle time.
The preheating systems differ fundamentally in the type of effect they have: convection systems (fans), radiation systems (short and long-wave) and induction systems. The decision in favour of a system should therefore be made on a product-specific basis and is often the result of our project evaluation. All preheating systems are monitored via temperature sensors in order to control the heat input and thus ensure a high level of process reliability via process data acquisition. The gradient of the heating phase is freely definable. By masking the assembly, it is possible to further significantly reduce the overall thermal stress.
After the soldering process, assemblies can be cooled down in a controlled manner to reduce cycle times and minimise stress on the PCB and components.
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