Reliable heating and cooling in the selective soldering process
Heating and cooling modules that act directly on the assembly can be integrated into the EUTECT system solutions for a component-friendly and cycle time-optimised soldering process.
Benefit
By preheating assemblies, it is possible to activate the previously applied flux and reduce the soldering time. Furthermore, preheating prevents solder bead formation and thermal shocks and promotes excellent soldering results.
Performance
Both the preheating and cooling processes are controlled and monitored via the operating data acquisition system.
Modularity
Modules for preheating and/or cooling can be integrated into all EUTECT process cells.
Product highlights
- Pyrometer-controlled heat input
- Highly dynamic heat input through quartz radiators and IR heaters
- Preheating and cooling modules can be freely integrated and extended
- Precise temperature processes through tunnelling systems
- Homogeneous heat input through fan heating
- Heat protection masks for sensitive assembly areas
Preheating techniques
Thanks to preheating, the possible material stress that can affect the PCB and the components already placed due to the heat input is minimised. This has a direct influence on the through-hole plating and the counterminiscus of the solder joint, thereby optimising the soldering quality and cycle time.
The preheating systems differ fundamentally in the type of effect they have: convection systems (fans), radiation systems (short and long-wave) and induction systems. The decision in favour of a system should therefore be made on a product-specific basis and is often the result of our project evaluation. All preheating systems are monitored via temperature sensors in order to control the heat input and thus ensure a high level of process reliability via process data acquisition. The gradient of the heating phase is freely definable. By masking the assembly, it is possible to further significantly reduce the overall thermal stress.
After the soldering process, assemblies can be cooled down in a controlled manner to reduce cycle times and minimise stress on the PCB and components.
EN 
DE