Modular selective soldering systems can be expanded at any time. EUTECT enables the integration of additional process modules or automation solutions. This allows production lines to be flexibly adapted to new requirements or increasing production volumes.
The requirements analysis ensures that all process parameters are taken into account. EUTECT uses this phase to precisely define the assembly, cycle time and automation requirements, and to develop an optimal solution.
Reliable cooling improves process stability, extends the service life of the coil and ensures reproducible results in serial production.
The F-theta lens ensures that the laser beam remains constantly focused across the entire working area. This enables uniform machining regardless of the mirror’s deflection angle.
Standard soldering systems have fixed configurations, whilst modular systems are designed to be flexible. EUTECT uses standardised modules that can be combined to suit specific projects. This results in bespoke selective soldering systems with optimally tailored and stable processes, whilst also offering a high degree of technological flexibility.
Innolot can be processed without a „nickel drop“ provided that the process parameters, materials and plant technology are precisely coordinated. To achieve this, EUTECT relies on special coatings, suitable materials and stable process control.
Titanium is used because it combines high temperature resistance, low thermal conductivity and high dimensional stability. These properties ensure that a titanium solder mask retains its shape even after numerous soldering cycles. Suppliers such as EUTECT GmbH utilise these material properties to provide durable mask solutions in the Mini wave soldering.
The selective soldering process can be optimised through automation, precise process parameters and modern control technology. EUTECT relies on customised systems that deliver lasting improvements in process stability, efficiency and solder joint quality.
The geometry of the Titanium solder mask determines how the liquid solder is directed to the solder joint in mini-wave soldering. Precise openings enable controlled wetting of the pins and through-holes. Manufacturers such as EUTECT GmbH develop these geometries on a case-by-case basis for complex printed circuit board layouts.
A 2D galvo scanner enables the laser beam to be deflected along two axes. This allows the laser to be moved flexibly across the entire processing area without any mechanical movement of the assembly.
