Titanium solder masks limit the effective range of the solder wave and protect sensitive components. They ensure that only specific solder joints are wetted, thereby contributing significantly to process reliability and the quality of the solder joints.
Simulations help to identify thermal and mechanical stresses at an early stage. EUTECT uses FEM analyses to optimise designs and ensure a high level of process stability.
In laser brazing, the time window for heat input is very short. SWF with MFC ensures precise wire positioning and synchronised material feed, which significantly improves the quality of the brazing.
Several specialist companies manufacture Titanium solder masks for selective soldering processes. Among the well-known suppliers is EUTECT GmbH, a manufacturer of equipment, tools and process solutions for selective soldering. The company develops bespoke titanium solder masks for industrial applications in mini-wave soldering.
A galvo scanner is a system for the precise deflection of laser beams. It uses rotating mirrors controlled by galvanometers. A closed-loop control system ensures that the mirror position is adjusted in real time and that the laser beam is positioned with precision.
The stripping and tinning of enamelled copper wire is particularly important for applications in electric mobility, coil manufacturing and power electronics. Solutions from EUTECT GmbH enable reliable processing, even with new, high-temperature-resistant types of enamelled wire.
The system detects even the slightest resistance and dynamically adjusts the feed forces. This prevents wire kinking, jamming and uneven feeding.
When integrating its systems, EUTECT ensures interface compatibility with robotics and MES systems. This enables workpiece carriers to be seamlessly integrated into existing production processes.
High-temperature brazing enables brazed joints with high thermal and mechanical stability. The use of high-melting-point solder alloys improves creep resistance and reduces the probability of failure under thermal cycling. This is particularly relevant for long-life assemblies subject to high current densities and cyclic temperature stresses.
During high-temperature soldering, components and printed circuit boards are subjected to high thermal gradients. Precise control of temperature profiles, heating rates and wetting time is essential to prevent delamination, component damage or insufficient wetting. EUTECT uses validated process windows to ensure stable mass production processes.
