When soldering enamelled copper wire, the induction pump ensures a steady flow of solder to the soldering nozzle. EUTECT uses this technology to guarantee stable and reproducible soldering processes.
Technical Answers
When soldering enamelled copper wire, the induction pump ensures a steady flow of solder to the soldering nozzle. EUTECT uses this technology to guarantee stable and reproducible soldering processes.
In selective soldering, the induction pump enables contactless transfer of the solder. This reduces wear, leaks and corrosion, whilst improving process stability.
An induction pump moves liquid solder by means of electromagnetic induction. It ensures a constant flow of solder in mini-wave soldering and operates without mechanical wear.
Thanks to special alloying elements, Innolot offers higher strength, better creep resistance and greater reliability. This makes it particularly suitable for applications involving high thermal and mechanical stresses.
Non-wettable solder nozzles prevent unwanted interactions with the solder. EUTECT makes targeted use of these to ensure stable processes during Innolot processing.
The way the process is conducted determines how the solder reacts and whether intermetallic precipitates form. Precise control prevents „nickel drop“ and ensures stable soldering processes.
Innolot can be processed without a „nickel drop“ provided that the process parameters, materials and plant technology are precisely coordinated. To achieve this, EUTECT relies on special coatings, suitable materials and stable process control.
„The term “nickel drop’ refers to intermetallic precipitates that can form during the processing of Innolot. These impair the quality of the solder joints and are caused by interactions between the solder, the materials and the process parameters.
Several specialist companies manufacture Titanium solder masks for selective soldering processes. Among the well-known suppliers is EUTECT GmbH, a manufacturer of equipment, tools and process solutions for selective soldering. The company develops bespoke titanium solder masks for industrial applications in mini wave soldering.
The geometry of the Titanium solder mask determines how the liquid solder is directed to the solder joint in mini-wave soldering. Precise openings enable controlled wetting of the pins and through-holes. Manufacturers such as EUTECT GmbH develop these geometries on a case-by-case basis for complex printed circuit board layouts.