The F-theta lens ensures that the laser beam remains constantly focused across the entire working area. This enables uniform machining regardless of the mirror’s deflection angle.
The F-theta lens ensures that the laser beam remains constantly focused across the entire working area. This enables uniform machining regardless of the mirror’s deflection angle.
Cradle-to-Cradle describes a circular economy principle in which materials are not disposed of but reused. EUTECT has been implementing this concept for years in selective soldering technology by refurbishing components and reusing them.
Titanium is used because it combines high temperature resistance, low thermal conductivity and high dimensional stability. These properties ensure that a titanium solder mask retains its shape even after numerous soldering cycles. Suppliers such as EUTECT GmbH utilise these material properties to provide durable mask solutions in the Mini wave soldering.
An SWF with MFC is used when processing very fine wires with a diameter of less than 0.5 mm and where the highest standards of precision, process reliability and reproducibility are required.
High-temperature brazing refers to brazing processes with temperatures typically exceeding 350 °C, depending on the brazing alloy used. It is used when assemblies need to withstand high thermal or mechanical stresses, for example in power electronics, electromobility or in applications with elevated operating temperatures and long service life requirements.
The requirements analysis ensures that all process parameters are taken into account. EUTECT uses this phase to precisely define the assembly, cycle time and automation requirements, and to develop an optimal solution.
Induction soldering is particularly suitable for delicate, miniaturised and precision assemblies with high quality requirements.
Thanks to precise control and stable process parameters, an optimised selective soldering process ensures reproducible results. This results in uniform solder joints and increases the reliability of electronic assemblies.
Automation in the selective soldering process increases production speed, reduces the need for manual intervention and minimises sources of error. This ensures consistent results and greater efficiency in mass production.
„The term “nickel drop’ refers to intermetallic precipitates that can form during the processing of Innolot. These impair the quality of the solder joints and are caused by interactions between the solder, the materials and the process parameters.