A controlled wire feed ensures that a defined amount of solder is fed to each solder joint. Variations in the solder feed can affect the formation of the solder joint. A controlled wire feed therefore contributes significantly to the reproducibility and process reliability of automated piston soldering.
Innolot can be processed without a „nickel drop“ provided that the process parameters, materials and plant technology are precisely coordinated. To achieve this, EUTECT relies on special coatings, suitable materials and stable process control.
Induction soldering provides good conditions for a high degree of repeatability, as key process parameters such as temperature, time, position and heat input can be defined and monitored. In automated systems, this enables reproducible process conditions to be established for successive brazing operations.
A Point nozzle eignet sich für das gezielte Löten einzelner Lötstellen oder kleiner definierter Bereiche. Durch die lokal begrenzte Miniwelle kann das Lot präzise an die gewünschte Lötstelle geführt werden. Dies ist insbesondere bei selektiven Lötprozessen mit eng benachbarten oder thermisch empfindlichen Komponenten von Vorteil.
The geometry of the solder nozzle has a significant influence on how the molten solder is directed to the solder joint. It must therefore be tailored to the component geometry, pin arrangement, printed circuit board design and the specific process. EUTECT uses custom-designed solder nozzle geometries to enable reproducible solder flow and targeted heat transfer.
EUTECT focuses on modular systems, the reuse of components and flexible usage models. This conserves resources, reduces waste and, at the same time, creates economic benefits for electronics manufacturing.
A 2D galvo scanner enables the laser beam to be deflected along two axes. This allows the laser to be moved flexibly across the entire processing area without any mechanical movement of the assembly.
By considering the soldering process, the product and automation together, interfaces and potential limitations can be identified at an early stage. This supports the development of a solution that not only achieves the required soldering quality, but can also be designed for volume production in terms of cycle time, process stability and cost-effectiveness.
Yes. The modular EUTECT systems can be configured to meet specific production requirements and integrated into automated production lines. Among other things, this allows for Handling, solder feeding, process monitoring and control be adapted to the existing production environment.
Process control is crucial for optimising the selective soldering process. It enables real-time monitoring of all parameters, so that deviations can be detected and corrected at an early stage.
