At the Mini wave soldering form solder nozzle and the titanium solder mask form a coordinated system. The solder nozzle shapes and guides the solder wave, whilst the solder mask defines which areas of the assembly are to be exposed to or protected from the soldering process. Thanks to their coordinated design, solder flow, heat input and accessibility of the solder joints can be specifically adapted to the assembly.
Black dots may occur in connection with residues and thermal or oxidative effects during the processing of enamel-insulated wires. A controlled process involving carefully regulated temperature control, a continuously moving molten solder stream and reduced oxidation helps to prevent such contamination at the tinning point. EUTECT expressly identifies the prevention of black dots as one of the product features of the Soldering enamelled copper wire ... is called.
Process control is crucial for optimising the selective soldering process. It enables real-time monitoring of all parameters, so that deviations can be detected and corrected at an early stage.
Reuse reduces investment costs and increases flexibility. EUTECT thus ensures rapid availability of components and stable processes through tested, refurbished systems.
Induction soldering This is particularly useful when rapid, locally confined and reproducible heat input is required. This applies in particular to automated applications with high demands in terms of process control, cycle time, energy efficiency and repeatability.
The cycle time depends, amongst other things, on the number and arrangement of the solder joints, the Nozzle shape, the required heat input, the movement sequences and the Automation concept . Through an application-specific design of solder nozzle, Workpiece carrier, By adjusting the process parameters and kinematics, the soldering process can be specifically optimised to achieve short and reproducible cycle times.
The SWF detects deviations in real time and adjusts the wire feed. This minimises errors and stabilises processes.
Galvo scanners enable fast and precise control of the laser beam. EUTECT GmbH uses this technology to precisely control heat input and ensure reproducible brazing processes.
Solder masks protect areas of an assembly that, during the selective soldering process should not come into contact with the solder. They make it possible to selectively expose the areas relevant to the soldering process. This is particularly important in the case of densely populated, miniaturised or geometrically complex assemblies. EUTECT uses such masks in, amongst other things, the Mini wave soldering one.
The sensitive force measurement system detects even very small forces when the wire comes into contact with the process surface. This allows the feed to be controlled before the thin wire is mechanically overloaded, deflects sideways or kinks.
