Technical Answers
Yes. Laser power, temperature profile, focus, solder feed and other process parameters can be defined to suit the specific assembly and soldering task. This allows the process to be adapted, for example, to different thermal masses, materials, geometries and quality requirements.
At the Laser soldering Energy is applied precisely at the actual process site. This means that it is not necessarily required to heat larger areas of the assembly. EUTECT uses air-cooled diode laser systems and cites high energy efficiency as one of the advantages of its laser brazing process.
Key influencing factors include, amongst others, laser power, temperature profile, focal position, exposure time, wire feed rate, solder quantity, solder alloy, flux, as well as the geometry and thermal mass of the joining components. To ensure a reproducible process, these parameters should be coordinated, monitored and documented.
Yes. Laser soldering It lends itself very well to automation thanks to its non-contact energy input, programmable process parameters and the ability to monitor the process. Laser modules can be integrated into various automation concepts and production cells and combined with further process steps.
The solder flow can be influenced, amongst other things, by ensuring the components to be joined are adequately preheated, by correctly positioning the laser focus, by adjusting the wire feed speed and by optimising the energy input. The flux content and solder alloy must also be suitable for the application in question.
Yes. That EUTECT laser brazing process It can be used for both lead-free and leaded solder joints. It is essential that the process parameters are tailored to the solder alloy, the components being joined and the assembly.
The laser power required depends on the specific application, the materials, the geometry and the thermal masses of the parts to be joined. EUTECT offers laser solutions ranging from single-beam to galvo optics, using diode lasers with power outputs from 25 to 1,500 watts.
A Galvo scanner This is particularly useful when several solder joints within a defined working area need to be processed in quick succession. As the laser beam is moved optically between the positions, mechanical travel movements can be reduced, thereby enabling shorter cycle times.
At the Galvo laser brazing The laser beam is directed to different process positions using rapidly moving mirrors. This means that the assembly or laser module needs to be moved less between individual solder joints. This can reduce process and cycle times, particularly where there are several solder joints spread out across the workpiece. EUTECT offers galvo scanners for this purpose as part of its laser brazing technology.
Yes. Data relevant to the process can be recorded and linked to the respective solder joint or the finished product. This enables the Laser soldering process can be documented in automated manufacturing environments and used to meet traceability requirements. EUTECT explicitly cites 100 % traceability as a product feature of its laser brazing process.
With EUTECT laser brazing, various process parameters can be monitored and documented. These include, amongst others, the temperature profile, laser power and wire feed rate. In addition, the EUTECT Recording Inspection Camera (ERICa) as well as the Solder Guard can be used for visual process monitoring and documentation.
The patented Sensitive Wire Feeder (SWF) EUTECT’s system enables force-, travel- and speed-controlled feeding of the solder wire. The force-sensing function allows, amongst other things, deviations in the wire feed to be detected. This enables the required amount of solder to be fed in a reproducible manner and increases process reliability.
‘Closed loop’ means that key process parameters are not merely set in advance, but are monitored and controlled throughout the soldering process. At EUTECT, the controlled laser power and the controlled wire feed combined with one another. This creates a closed-loop control system that ensures the process stability and reproducibility of the Laser brazing process supported.
At the EUTECT laser soldering The temperature at the process site is measured using a high-speed pyrometer. Based on the measured temperature, the laser power is controlled and adjusted to suit the specific process. This allows, for example, for differences in the absorption behaviour or thermal properties of the materials being joined to be taken into account.
As the laser energy can be precisely focused on the actual process site, the thermal stress on the surrounding areas is reduced. In contrast to processes in which larger areas of an assembly are heated, the heat input during the Laser soldering limit it locally.
Laser soldering It is particularly suitable for selective soldering tasks where heat needs to be applied in a highly targeted manner. Typical applications can be found in electronics manufacturing, for example with sensitive electronic components, sensors, connectors and complex assemblies with limited installation space.
Laser soldering enables precise, non-contact and locally confined heat input. This makes the process particularly suitable for temperature-sensitive components, high packing densities and hard-to-reach solder joints. Further advantages include high reproducibility, short process times, low maintenance requirements and good integration into automated production lines.
Errors are reduced through precise wire feeding, stable processes and real-time monitoring. This increases first-pass yield and reduces rework and production costs.
The system detects even the slightest resistance and dynamically adjusts the feed forces. This prevents wire kinking, jamming and uneven feeding.
In laser brazing, the time window for heat input is very short. SWF with MFC ensures precise wire positioning and synchronised material feed, which significantly improves the quality of the brazing.
MicroForceControl enables precise force control, prevents wire jams and ensures a defined amount of solder. This results in stable processes and consistently high soldering quality.
An SWF with MFC is used when processing very fine wires with a diameter of less than 0.5 mm and where the highest standards of precision, process reliability and reproducibility are required.
An SWF with MFC is a high-precision wire feed system with integrated force control. It enables controlled wire feeding whilst simultaneously providing process data for monitoring and optimisation.
The F-theta lens ensures that the laser beam remains constantly focused across the entire working area. This enables uniform machining regardless of the mirror’s deflection angle.
A 2D galvo scanner enables the laser beam to be deflected along two axes. This allows the laser to be moved flexibly across the entire processing area without any mechanical movement of the assembly.
Galvo scanners enable fast and precise control of the laser beam. EUTECT GmbH uses this technology to precisely control heat input and ensure reproducible brazing processes.
A galvo scanner is a system for the precise deflection of laser beams. It uses rotating mirrors controlled by galvanometers. A closed-loop control system ensures that the mirror position is adjusted in real time and that the laser beam is positioned with precision.
