The rework removes deposits and oxide layers that can affect solder flow. This improves process stability and ensures a consistently high standard of soldering quality in mini-wave soldering.
The rework removes deposits and oxide layers that can affect solder flow. This improves process stability and ensures a consistently high standard of soldering quality in mini-wave soldering.
Titanium is used because it combines high temperature resistance, low thermal conductivity and high dimensional stability. These properties ensure that a titanium solder mask retains its shape even after numerous soldering cycles. Suppliers such as EUTECT GmbH utilise these material properties to provide durable mask solutions in the Mini wave soldering.
„The term “nickel drop’ refers to intermetallic precipitates that can form during the processing of Innolot. These impair the quality of the solder joints and are caused by interactions between the solder, the materials and the process parameters.
In selective soldering, the induction pump enables contactless transfer of the solder. This reduces wear, leaks and corrosion, whilst improving process stability.
Titanium solder masks limit the effective range of the solder wave and protect sensitive components. They ensure that only specific solder joints are wetted, thereby contributing significantly to process reliability and the quality of the solder joints.
The SWF detects deviations in real time and adjusts the wire feed. This minimises errors and stabilises processes.
Yes, precise alignment is essential. Only when the solder nozzle and the titanium solder masks are geometrically aligned will the solder wave be guided correctly. This prevents defects and ensures consistent and reproducible solder joint quality.
The modular concept combines standardised functional modules such as the mini-wave, fluxer, preheating unit and handling system. EUTECT integrates these modules into a complete system in line with the assembly requirements. This results in an automated, precisely coordinated and scalable soldering process.
Cradle-to-Cradle describes a circular economy principle in which materials are not disposed of but reused. EUTECT has been implementing this concept for years in selective soldering technology by refurbishing components and reusing them.
Modular selective soldering systems can be expanded at any time. EUTECT enables the integration of additional process modules or automation solutions. This allows production lines to be flexibly adapted to new requirements or increasing production volumes.