An SWF with MFC is used when processing very fine wires with a diameter of less than 0.5 mm and where the highest standards of precision, process reliability and reproducibility are required.
An SWF with MFC is used when processing very fine wires with a diameter of less than 0.5 mm and where the highest standards of precision, process reliability and reproducibility are required.
A titanium solder mask precisely directs the solder flow to the defined solder joints and prevents solder bridges or uncontrolled wetting. This results in reproducible solder joints with consistent process quality. Specialist manufacturers such as EUTECT GmbH develop mask-specific geometries for mini-wave soldering processes for this purpose.
Induction soldering is particularly suitable for delicate, miniaturised and precision assemblies with high quality requirements.
Optimising the selective soldering process improves the quality of the solder joints, enhances process reliability and reduces production costs. In safety-critical sectors in particular, a stable and reproducible soldering process is crucial to the reliability of the assemblies.
MicroForceControl enables precise force control, prevents wire jams and ensures a defined amount of solder. This results in stable processes and consistently high soldering quality.
The E-Cell is a modular production solution that integrates several processes. It enables compact, flexible and efficient manufacturing and can be customised to meet a range of requirements.
Modular selective soldering systems can be expanded at any time. EUTECT enables the integration of additional process modules or automation solutions. This allows production lines to be flexibly adapted to new requirements or increasing production volumes.
At EUTECT, items such as mini-wave modules, soldering nozzles, control components and complete process cells are reused. These are inspected, refurbished and then reintegrated into production processes.
Titanium is used because it combines high temperature resistance, low thermal conductivity and high dimensional stability. These properties ensure that a titanium solder mask retains its shape even after numerous soldering cycles. Suppliers such as EUTECT GmbH utilise these material properties to provide durable mask solutions in the Mini wave soldering.
The way the process is conducted determines how the solder reacts and whether intermetallic precipitates form. Precise control prevents „nickel drop“ and ensures stable soldering processes.