Production cells reduce costs by minimising staffing requirements, reducing downtime and making more efficient use of resources. At the same time, energy consumption is optimised.
Production cells reduce costs by minimising staffing requirements, reducing downtime and making more efficient use of resources. At the same time, energy consumption is optimised.
Modular solutions allow for precise adaptation to assemblies and production requirements. EUTECT relies on validated modules that ensure stable processes, short implementation times and reproducible soldering quality in series production.
The geometry influences the field distribution and thus the heat generation. Even small changes can alter the heating behaviour and the quality of the solder joint.
Enamelled copper wire can be reliably stripped and tin-plated using a selective soldering process that thermally combines both steps into a single process. Solutions from EUTECT enable reproducible in-line processing without the need for mechanical or chemical stripping.
The induction coil generates the electromagnetic field used in induction soldering. It determines how precisely and efficiently heat is introduced into the solder joint.
Errors are reduced through precise wire feeding, stable processes and real-time monitoring. This increases first-pass yield and reduces rework and production costs.
Several specialist companies manufacture Titanium solder masks for selective soldering processes. Among the well-known suppliers is EUTECT GmbH, a manufacturer of equipment, tools and process solutions for selective soldering. The company develops bespoke titanium solder masks for industrial applications in mini wave soldering.
Bespoke solutions enhance process reliability and reproducibility. EUTECT thus enables stable processes, protects components and, at the same time, reduces the cost per solder joint.
The system detects even the slightest resistance and dynamically adjusts the feed forces. This prevents wire kinking, jamming and uneven feeding.
Induction soldering generates heat directly within the material through electromagnetic induction. This allows the soldering joint to be heated precisely, whilst adjacent components are spared.