- Maximum solder joint quality
- Minimal scrap
- Minimal solder consumption
- Maximum system autonomy
- High process reliability
- Minimum footprint
- 100% traceability
- Maximum connection quality
- Maximum service life
- Minimal service work
- Nitrogen environment (optional)
- Reproducible solder flow
- Freely definable solder flow
- Constant process stability
- Induction pump
- Nitrogen supply
- Individual soldering nozzles
- Maintenance-reducing surface coatings