For mini wave soldering, the exact alignment of the soldering nozzle and titanium solder mask is crucial for process reliability and the quality of the solder joints. Both components form a functional unit that defines the solder flow, the wetting surfaces, and the precision and quality of the solder joints.
The geometry of the solder nozzle - in particular nozzle opening, outlet angle, wave characteristics and flow parameters - significantly determines the wetting dynamics and the penetration behaviour of the solder wave onto the PCB.
The titanium solder mask acts as a precise soldering boundary that precisely defines the impact area of the mini wave and ensures that only the intended solder pads are contacted. At the same time, it protects thermally and mechanically sensitive component areas from unwanted solder wetting and thermal stress.
Geometric deviations between the nozzle contour and the mask cut-out can change the flow characteristics of the solder wave and thus lead to incorrect wetting, solder bridge formation or incomplete wetting of the solder joints.
Since mini wave soldering generates high temperatures, the thermal behavior of the titanium masks also needs to be considered. Only when the mask and nozzle are aligned in terms of material expansion and positioning the solder quality remains stable over many process cycles.
Precise alignment of both components also reduces spatter, flux residue and mechanical wear, which extends the service life of the tools and makes the process more economical. The close alignment of the solder nozzle and titanium solder mask is therefore an important prerequisite for reproducible, clean and durable solder joints in the mini wave soldering process.
Come to productronica and find out more about optimising your soldering process with coordinated solder nozzles and titanium solder masks. We cordially invite you to visit us at stand B2, 439.
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