Individual, product-specific solder nozzles are a crucial component of EUTECT mini wave and enameled copper wire soldering and guarantee reliable and cycle-time-optimized solder wetting of the components and substrates to be soldered. Thanks to the various nozzle geometries, such as point, ring, line or matrix nozzles, specific soldering tasks can be solved precisely. The adapted, single-sided, non-wettable solder nozzle and the resulting constant, laminar solder flow generate perfect results for the respective soldering process with a very long service life. The non-wettable solder nozzle significantly reduces the service and maintenance effort, and wear compared to a solder nozzle that runs all around.
For an optimal soldering result, it is important that the geometry of the solder nozzle, together with the nitrogen hood, is matched to the product to be soldered. Therefore, each solder nozzle is given an individually adapted gas hood geometry. This minimizes the formation of oxides on the solder and improves the wetting properties. The controlled nitrogen supply also allows flexible adaptation to different process conditions, enabling a consistently high soldering quality to be achieved..
A product-specific soldering nozzle, in combination with product-specific titanium masks and workpiece carriers, enables maximum solder joint quality with long service life and optimal cycle times. The materials used for this are corrosion and heat resistant, making them ideal for use in high-temperature applications. With these advanced solutions, EUTECT is helping companies to make their soldering processes more efficient and ensure reliable quality assurance. Using customized nozzle geometries, complex soldering requirements can be met and process reliability in production increased.
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