Innovative nozzle geometries for perfect mini-wave soldering processes

Individuelle, produktspezifische Lotdüsen sind ein entscheidender Bestandteil das EUTECT-Miniwellen– und Enamelled copper wire soldering und garantieren eine zuverlässige und taktzeitoptimierte Lotbenetzung der zu verlötenden Bauteile und Substrate. Durch die verschiedene Düsengeometrien wie Punkt-, Ring-, Linien- oder Matrixdüsen, können spezifische Lötaufgaben präzise gelöst werden. Durch die angepasste, einseitig ablaufende, nicht benetzbare Lötdüse und dem daraus entstehenden konstanten, laminaren Lotfluss, werden perfekte Ergebnisse für den jeweiligen Lötprozess bei sehr hohen Standzeiten generiert. Durch die nicht benetzbare Lötdüse ist der Service- und Wartungsaufwand sowie der Verschleiß gegenüber einer rundum ablaufenden Lötdüse deutlich minimiert.

For an optimal soldering result, it is important that the geometry of the solder nozzle, together with the nitrogen hood, is matched to the product to be soldered. Therefore, each solder nozzle is given an individually adapted gas hood geometry. This minimizes the formation of oxides on the solder and improves the wetting properties. The controlled nitrogen supply also allows flexible adaptation to different process conditions, enabling a consistently high soldering quality to be achieved..

A product-specific soldering nozzle, in combination with product-specific titanium masks and workpiece carriers, enables maximum solder joint quality with long service life and optimal cycle times. The materials used for this are corrosion and heat resistant, making them ideal for use in high-temperature applications. With these advanced solutions, EUTECT is helping companies to make their soldering processes more efficient and ensure reliable quality assurance. Using customized nozzle geometries, complex soldering requirements can be met and process reliability in production increased.

Selective enamelled copper wire soldering

Enamelled copper wire soldering

With conventional soldering technology, enamelled copper wires coated with polyurethane or polyesterimide cannot be processed without oxide formation or insulation residues. The mini wave soldering module from EUTECT prevents this without any loss of service life.

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Workpiece carrier

Workpiece carrier and mask technology

Product-specific workpiece carriers and mask technologies protect assemblies during transport and processing. EUTECT develops them individually tailored to each assembly and each soldering process for precise and stable results.

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Duesen technology

Nozzle geometries

Individual, product-specific solder nozzles are a key component of the EUTECT mini-waves and guarantee reliable and cycle time-optimised solder wetting of the components and substrates to be soldered.

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Matrixduese

Mini wave soldering

EUTECT mini wave soldering is characterised by the one-sided, non-wettable nozzle technology in combination with the horizontally installed, inductive pump technology.

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