Solution competence

How does EUTECT manufacture titanium soldering masks and workpiece carriers for structured processes and maximum precision?

The production of titanium soldering masks and workpiece carriers is carried out at EUTECT in a clearly defined, four-stage process that guarantees maximum precision, process reliability and customer focus. Every single carrier and every soldering masks is the result of carefully coordinated construction expertise, selective soldering technology and a design suitable for automation.

It all starts with analysing the requirements. All relevant parameters are documented in close consultation with the customer. These include the assembly geometry, the desired cycle time, the desired soldering process, the required fixing strategy and the handling concept. The aim is to gain a comprehensive understanding of the requirements of the subsequent soldering process.

The next step involves design and simulation. Based on the analysed requirements, an individual titanium solder mask and workpiece carrier are designed using CAD systems. If necessary, EUTECT supplements the design with FEM analyses in order to evaluate and optimise thermal and mechanical loads at an early stage. Factors such as heat dissipation, component positioning and soldering accessibility are specifically taken into account.

The third step is production. The masking and the workpiece carrier are produced according to the specified geometry and choice of material and precisely matched to the automation solution, process stations and kinematics used. High-quality materials and tight tolerances ensure durable, reliable solutions.

Finally, the process is integrated. The finished carrier is integrated into the customer's production environment. EUTECT pays attention to interface compatibility, for example with robot handling or MES systems, and ensures complete traceability using RFID technology if required. This allows the carrier to be seamlessly integrated into existing processes and reliably fulfil the required cycle time.

This structured process ensures precisely manufactured workpiece carriers that are economical, functional and durable and are always tailored to the specific requirements of modern selective soldering processes. The titanium solder masks and workpiece carriers are therefore more than just tools; they are precisely harmonised solutions between the assembly, soldering process and automation. This increases quality and reproducibility, protects sensitive components, reduces consumption and measurably lowers the costs per solder joint.

Duesen technology

Nozzle geometries

Individual, product-specific solder nozzles are a key component of the EUTECT mini-waves and guarantee reliable and cycle time-optimised solder wetting of the components and substrates to be soldered.

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Employees mixing a cradle-to-cradle system

Cradle to Cradle

In addition to labour time, material values are also incorporated into every system that EUTECT delivers.

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Matrixduese

Mini wave soldering

EUTECT mini wave soldering is characterised by the one-sided, non-wettable nozzle technology in combination with the horizontally installed, inductive pump technology.

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