Solution competence

Frequently asked questions about selective soldering

We create connections. We create connections. The optimum solution for your selective soldering automation.

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Questions & Answers (Overview):

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Enamelled copper wire can be reliably stripped and tin-plated using a selective soldering process that thermally combines both steps into a single process. Solutions from EUTECT enable reproducible in-line processing without the need for mechanical or chemical stripping.

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High-temperature brazing enables brazed joints with high thermal and mechanical stability. The use of high-melting-point solder alloys improves creep resistance and reduces the probability of failure under thermal cycling. This is particularly relevant for long-life assemblies subject to high current densities and cyclic temperature stresses.

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Non-wettable solder nozzles prevent unwanted interactions with the solder. EUTECT makes targeted use of these to ensure stable processes during Innolot processing.

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In laser brazing, the time window for heat input is very short. SWF with MFC ensures precise wire positioning and synchronised material feed, which significantly improves the quality of the brazing.

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A galvo scanner is a system for the precise deflection of laser beams. It uses rotating mirrors controlled by galvanometers. A closed-loop control system ensures that the mirror position is adjusted in real time and that the laser beam is positioned with precision.

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A production cell combines several manufacturing steps within a single system. This shortens lead times, reduces transport requirements and improves process control. This results in greater efficiency and better quality.

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Thanks to special alloying elements, Innolot offers higher strength, better creep resistance and greater reliability. This makes it particularly suitable for applications involving high thermal and mechanical stresses.

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Various processes, such as mini-wave, laser and thermode soldering, can be integrated into the modular systems. EUTECT combines these technologies depending on the application to ensure reliable soldering even of complex and thermally sensitive assemblies.

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Modular solutions allow for precise adaptation to assemblies and production requirements. EUTECT relies on validated modules that ensure stable processes, short implementation times and reproducible soldering quality in series production.

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Reproducible processes require defined process windows, closed-loop control systems for temperature and solder flow, and continuous process monitoring. In-line systems with a nitrogen atmosphere and validated parameters, such as those used by EUTECT, ensure consistent quality in series production.