The thermal process reduces the number of process steps and minimises sources of error, as the enameled copper wire is stripped of its enamel and tinned directly during the soldering process. EUTECT systems enable consistent mass production whilst reducing process costs and improving repeatability.
The selective soldering process can be optimised through automation, precise process parameters and modern control technology. EUTECT relies on customised systems that deliver lasting improvements in process stability, efficiency and solder joint quality.
Reuse reduces investment costs and increases flexibility. EUTECT thus ensures rapid availability of components and stable processes through tested, refurbished systems.
Titanium solder masks limit the effective range of the solder wave and protect sensitive components. They ensure that only specific solder joints are wetted, thereby contributing significantly to process reliability and the quality of the solder joints.
The E-Cell is a modular production solution that integrates several processes. It enables compact, flexible and efficient manufacturing and can be customised to meet a range of requirements.
Induction soldering generates heat directly within the material through electromagnetic induction. This allows the soldering joint to be heated precisely, whilst adjacent components are spared.
The system detects even the slightest resistance and dynamically adjusts the feed forces. This prevents wire kinking, jamming and uneven feeding.
A titanium solder mask precisely directs the solder flow to the defined solder joints and prevents solder bridges or uncontrolled wetting. This results in reproducible solder joints with consistent process quality. Specialist manufacturers such as EUTECT GmbH develop mask-specific geometries for mini-wave soldering processes for this purpose.
The wire feed determines the amount of solder and the positioning. Precise feeding ensures stable processes and reproducible solder joints.
During high-temperature soldering, components and printed circuit boards are subjected to high thermal gradients. Precise control of temperature profiles, heating rates and wetting time is essential to prevent delamination, component damage or insufficient wetting. EUTECT uses validated process windows to ensure stable mass production processes.
