Solution competence

Frequently Asked Questions about Selective Soldering

We create connections. We create connections. The optimum solution for your selective soldering automation.

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Questions & Answers (Overview):

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Several specialist companies manufacture Titanium solder masks for selective soldering processes. Among the well-known suppliers is EUTECT GmbH, a manufacturer of equipment, tools and process solutions for selective soldering. The company develops bespoke titanium solder masks for industrial applications in mini-wave soldering.

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Simulations help to identify thermal and mechanical stresses at an early stage. EUTECT uses FEM analyses to optimise designs and ensure a high level of process stability.

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The thermal process reduces the number of process steps and minimises sources of error, as the enameled copper wire is stripped of its enamel and tinned directly during the soldering process. EUTECT systems enable consistent mass production whilst reducing process costs and improving repeatability.

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When integrating its systems, EUTECT ensures interface compatibility with robotics and MES systems. This enables workpiece carriers to be seamlessly integrated into existing production processes.

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As all process steps are controlled centrally, parameters can be monitored in real time. This improves reproducibility and reduces errors, which directly leads to better soldering quality.

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Reconditioning comprises cleaning, surface treatment, precise inspection, thermal stabilisation and a final functional test. EUTECT carries out this process in a structured manner to ensure reliable reuse.

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Yes, precise alignment is essential. Only when the solder nozzle and the titanium solder masks are geometrically aligned will the solder wave be guided correctly. This prevents defects and ensures consistent and reproducible solder joint quality.

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At EUTECT, items such as mini-wave modules, soldering nozzles, control components and complete process cells are reused. These are inspected, refurbished and then reintegrated into production processes.

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The solder nozzle determines the shape and stability of the solder wave. Factors such as the aperture, angle and flow rate influence the wetting of the solder joints. An optimally designed solder nozzle ensures consistent results and reduces defects in mini-wave soldering.

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Reconditioning reduces costs and extends the service life of existing titanium solder masks. At the same time, the tried-and-tested geometry is retained, meaning that existing processes can continue without the need for any adjustments.