As all process steps are controlled centrally, parameters can be monitored in real time. This improves reproducibility and reduces errors, which directly leads to better soldering quality.
As all process steps are controlled centrally, parameters can be monitored in real time. This improves reproducibility and reduces errors, which directly leads to better soldering quality.
Innolot can be processed without a „nickel drop“ provided that the process parameters, materials and plant technology are precisely coordinated. To achieve this, EUTECT relies on special coatings, suitable materials and stable process control.
The requirements analysis ensures that all process parameters are taken into account. EUTECT uses this phase to precisely define the assembly, cycle time and automation requirements, and to develop an optimal solution.
When soldering enamelled copper wire, the induction pump ensures a steady flow of solder to the soldering nozzle. EUTECT uses this technology to guarantee stable and reproducible soldering processes.
The geometry of the Titanium solder mask determines how the liquid solder is directed to the solder joint in mini-wave soldering. Precise openings enable controlled wetting of the pins and through-holes. Manufacturers such as EUTECT GmbH develop these geometries on a case-by-case basis for complex printed circuit board layouts.
A production cell combines several manufacturing steps within a single system. This shortens lead times, reduces transport requirements and improves process control. This results in greater efficiency and better quality.
Induction soldering generates heat directly within the material through electromagnetic induction. This allows the soldering joint to be heated precisely, whilst adjacent components are spared.
The modular concept combines standardised functional modules such as the mini-wave, fluxer, preheating unit and handling system. EUTECT integrates these modules into a complete system in line with the assembly requirements. This results in an automated, precisely coordinated and scalable soldering process.
MicroForceControl enables precise force control, prevents wire jams and ensures a defined amount of solder. This results in stable processes and consistently high soldering quality.
The frequency determines the penetration depth of the induced currents. High frequencies tend to heat the surface, whilst lower frequencies penetrate deeper into the material.