Yes, precise alignment is essential. Only when the solder nozzle and the titanium solder masks are geometrically aligned will the solder wave be guided correctly. This prevents defects and ensures consistent and reproducible solder joint quality.
Technical Answers
Yes, precise alignment is essential. Only when the solder nozzle and the titanium solder masks are geometrically aligned will the solder wave be guided correctly. This prevents defects and ensures consistent and reproducible solder joint quality.
Restoring the mask geometry and surface stabilises the flow of solder. EUTECT ensures that titanium solder masks once again deliver reproducible results and that a consistently high quality of soldering is achieved in mini-wave soldering.
Reconditioning reduces costs and extends the service life of existing titanium solder masks. At the same time, the tried-and-tested geometry is retained, meaning that existing processes can continue without the need for any adjustments.
Reconditioning comprises cleaning, surface treatment, precise inspection, thermal stabilisation and a final functional test. EUTECT carries out this process in a structured manner to ensure reliable reuse.
The rework removes deposits and oxide layers that can affect solder flow. This improves process stability and ensures a consistently high standard of soldering quality in mini-wave soldering.
Yes, titanium solder masks can be restored almost entirely to their original condition through a structured reconditioning process. EUTECT GmbH achieves this through cleaning, surface treatment, inspection and heat treatment, thereby ensuring that the geometry and function once again meet the requirements for mini-wave soldering.
The stripping and tinning of enamelled copper wire is particularly important for applications in electric mobility, coil manufacturing and power electronics. Solutions from EUTECT GmbH enable reliable processing, even with new, high-temperature-resistant types of enamelled wire.
An inline process makes it possible to remove the enamel from and tin-plate enamelled copper wire without the need for separate pre-treatment. This reduces lead times and process costs. EUTECT’s technologies also ensure stable processes and consistently high quality in series production.
The thermal process reduces the number of process steps and minimises sources of error, as the enameled copper wire is stripped of its enamel and tinned directly during the soldering process. EUTECT systems enable consistent mass production whilst reducing process costs and improving repeatability.
Enamelled copper wire can be reliably stripped and tin-plated using a selective soldering process that thermally combines both steps into a single process. Solutions from EUTECT enable reproducible in-line processing without the need for mechanical or chemical stripping.