- What options do you have to support your soldering process during the step-through?
With THT soldering, it can happen that the via does not form optimally. In this case, the solder does not rise completely through the via and no 100%iger counter miniscus is formed.
Firstly, check whether the ratio of the hole diameter to the pin and the connection partner geometry have been selected correctly. If this is the case, you have the following options for process optimisation:
Mini wave or selective soldering
- Increase solder bath temperature and check whether the desired temperature is reached at the process point
- Increase contact time between mini shaft and product
- Increase preheating temperature, activation or preheating duration
- Checking the optimum amount of flux
- Check whether the correct flux is being used in relation to solids and other activators
Laser soldering
- Use of a preheater to introduce heat into the joining partners, which facilitates solder penetration
- Positioning of the laser focus at the correct angle and position in relation to the product geometry, solder feed and overall product geometry
- Checking the feeding speed of the solder wire
- Introduction of further energy after melting the wire
- Checking the optimum flux content and the correct alloy in the solder wire
If you continue to have problems getting through, please contact us and we will help you to optimise your soldering process.
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