At this year's productronica in Munich Eutect GmbH presents its latest generation of titanium solder masks for the mini wave soldering. The customised masks are produced in the in-house technology centre together with matching solder nozzles and enable maximum precision, process stability and cost-effectiveness, even with complex assemblies, sensitive geometries and high quantities. This underlines Eutect's role as an innovative provider of integrated solutions for modern selective soldering processes.
With the specially developed titanium solder masks and based on decades of experience in selective soldering Eutect sets high standards for quality and efficiency in selective soldering. Specially selected titanium materials in combination with the company's own surface treatments ensure solder-repellent, particularly smooth surfaces and minimised heat sinks. Sensitive components and housings are effectively protected, while at the same time thin-walled designs and optimised solder flow guidance ensure improved wetting and high solder penetration. Three-dimensional designs reduce the influence of component tolerances and increase reproducibility. With this development, EUTECT offers a practice-orientated solution for precise selective soldering processes.
Thanks to the customised design and Eutect's comprehensive process expertise, masks are created that are perfectly tailored to every component and every process by integrating fixing and hold-down elements through to catch geometries. Eutect's solder masks are precisely harmonised solutions between the assembly, soldering process and automation. This increases quality and reproducibility, protects sensitive components, reduces consumption and measurably lowers the costs per solder joint and can also be seamlessly integrated into non-EUTECT systems. As the masks are developed in close coordination with solder nozzles and process parameters, these optimised mini-wave and selective soldering processes are stable, reproducible and reliable. The result is greater process reliability, high-quality solder joints, minimised material stress, longer service life, reduced costs and an overall increase in cost-effectiveness. Eutect not only produces solder masks for its own soldering systems, but also offers them to users of third-party systems.
"Selective soldering of electronic assemblies is becoming more and more demanding due to increasing miniaturisation, complex geometries and higher requirements for process reliability and durability. To meet these challenges, we have been using customised solder masks developed in-house since 1996."
Titanium solder masks precisely control the solder flow on a PCB, limit the solder supply to certain areas and protect sensitive components.
"Based on our decades of experience, our masking systems are created in our in-house technical centre, often together with the development of the appropriate solder nozzle, so that end customers receive a complete, optimally coordinated solution for our systems as well as for third-party systems."
Composite materials often reach their limits when it comes to complex masking. For example, if assemblies are already mounted in housings and SMD components on the underside are very close to the housing and the THT solder joints to be soldered, walls, intermediate webs and connections must be extremely thin and still remain stable in the long term. The same applies to baffle walls and pressure chambers, which must be manufactured with precision as they perform important functions due to miniaturisation. This is why all Eutect masks are made of titanium. Titanium is indispensable, especially when web widths of far less than one millimetre are required and high durability is expected at the same time. Thanks to its high strength, even bridge widths of less than 0.5 mm can be realised. The metal is also durable and resistant to fluxes, aggressive cleaning substrates and other chemical influences. Due to the high process temperatures and process cycles required by customers, the masks are manufactured as full titanium masks.
The masks can be equipped with additional functions. If components or connectors need to be aligned or fixed, the masks are equipped with specific catch geometries or fixing systems so that all components remain in the intended position. This means that nothing stands in the way of transporting the mask using a workpiece carrier on an inline system. The mask geometry, hold-down devices, alignment elements and sliders are determined as part of the evaluation and project development. Fixing systems consisting of spring and latching elements guarantee a high level of functionality, and attention is paid to easy loading and unloading of the masks.
"In the end, we customise the mask to the customer's requirements. As we are involved in the project right from the start, the customisation is a formality. Thanks to this close collaboration, the number of masks produced increases every year."
Titanium solder masks are therefore far more than just an aid. They are the key to precise, stable and economical selective soldering, even for complex assemblies, sensitive geometries and large quantities. The close integration of mask technology and solder nozzle design, as well as customised additional functions, results in maximum functionality and efficiency, which is measurably reflected in the quality, reliability and productivity of the soldering processes.
Eutect GmbH will be exhibiting at productronica 2025 in Munich from 18 to 21 November 2025. Eutect will be presenting innovative solutions for selective soldering, including precise workpiece carriers and solder masks, at stand 439 in hall B2.
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