Lift-dip soldering is used in particular where individual components such as stators or enamelled copper wires and strands need to be tinned in a targeted and controlled manner. As a specialist in selective soldering technology EUTECT has developed customised lift-dip soldering modules and systems that are characterised by high process stability, reproducible soldering results and flexible integration into automated production environments. EUTECT has further developed and optimised the lift-dip module specifically for this process.
In lift-dip soldering the assembly is immersed in a defined solder bath in a controlled manner. The lift-dip module now optimised by EUTECT is characterised by a number of technical innovations. The soldering process takes place with a nitrogen-inerted solder bath, whereby the nitrogen supply is monitored and visualised. The module is also equipped with a slag container, which is also monitored. Surface impurities or dross from the solder bath surface are pushed into it cyclically using a scraper:
„The check is carried out by a scale, which informs the operator in good time when the container is full.“
In addition to the dipping function, an automatic, quick-change and product-specific scoop can also be used, which uses a motorised system to transport solder from the bath to the top and thus enables even more precise transport of the solder to the soldering joint, especially in complex applications.
The solder bath itself is sealed between the soldering processes so that the solder is protected from oxidation or contamination. The motorised drive and other electronics are located behind the solder bath and are separated from the hot solder bath by thermal decoupling. This significantly reduces thermal loads, minimises material stress and increases the service life of the components. In addition, the system has a solder bath height control with automatic tin feed for constant control and readjustment of the solder quantity. The solder bath temperature is redundantly controlled.
A key advantage of EUTECT's lift-dip soldering is the exact process regulation and control. Parameters such as immersion depth, stroke speed, dwell time and temperature control can be precisely adjusted to the respective application. This results in uniform and reproducible solder joints with high wetting quality.
The process also enables a high degree of automation. Modern EUTECT lift-dip soldering systems and modules can be fully integrated into automated production lines. In conjunction with intelligent process monitoring and control systems, production data can be continuously recorded, documented and analysed. This not only improves process stability, but also supports long-term quality assurance.
A further advantage of lift-dip soldering is its flexibility with regard to different assemblies and series sizes. Both small series with a wide range of variants and larger production volumes can be realised economically. Thanks to specially developed workpiece carriers, solder masks and application-specific process fixtures, even complex assemblies can be reliably positioned and reproducibly soldered.
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