Technical Answers
Modular selective soldering systems can be expanded at any time. EUTECT enables the integration of additional process modules or automation solutions. This allows production lines to be flexibly adapted to new requirements or increasing production volumes.
Various processes, such as mini-wave, laser and thermode soldering, can be integrated into the modular systems. EUTECT combines these technologies depending on the application to ensure reliable soldering even of complex and thermally sensitive assemblies.
Modular solutions allow for precise adaptation to assemblies and production requirements. EUTECT relies on validated modules that ensure stable processes, short implementation times and reproducible soldering quality in series production.
The modular concept combines standardised functional modules such as the mini-wave, fluxer, preheating unit and handling system. EUTECT integrates these modules into a complete system in line with the assembly requirements. This results in an automated, precisely coordinated and scalable soldering process.
Standard soldering systems have fixed configurations, whilst modular systems are designed to be flexible. EUTECT uses standardised modules that can be combined to suit specific projects. This results in bespoke selective soldering systems with optimally tailored and stable processes, whilst also offering a high degree of technological flexibility.
Reproducible processes require defined process windows, closed-loop control systems for temperature and solder flow, and continuous process monitoring. In-line systems with a nitrogen atmosphere and validated parameters, such as those used by EUTECT, ensure consistent quality in series production.
Typical applications include power semiconductors, power supplies, electric motors and assemblies in automotive and industrial electronics. High-temperature soldering is essential, particularly in cases involving high operating temperatures, high current loads or safety-critical functions, in order to ensure long-term reliability and mechanical stability.
During high-temperature soldering, components and printed circuit boards are subjected to high thermal gradients. Precise control of temperature profiles, heating rates and wetting time is essential to prevent delamination, component damage or insufficient wetting. EUTECT uses validated process windows to ensure stable mass production processes.
High-temperature brazing enables brazed joints with high thermal and mechanical stability. The use of high-melting-point solder alloys improves creep resistance and reduces the probability of failure under thermal cycling. This is particularly relevant for long-life assemblies subject to high current densities and cyclic temperature stresses.
High-temperature brazing refers to brazing processes with temperatures typically exceeding 350 °C, depending on the brazing alloy used. It is used when assemblies need to withstand high thermal or mechanical stresses, for example in power electronics, electromobility or in applications with elevated operating temperatures and long service life requirements.
