Technical Answers
Typical applications include power semiconductors, power supplies, electric motors and assemblies in automotive and industrial electronics. High-temperature soldering is essential, particularly in cases involving high operating temperatures, high current loads or safety-critical functions, in order to ensure long-term reliability and mechanical stability.
During high-temperature soldering, components and printed circuit boards are subjected to high thermal gradients. Precise control of temperature profiles, heating rates and wetting time is essential to prevent delamination, component damage or insufficient wetting. EUTECT uses validated process windows to ensure stable mass production processes.
High-temperature brazing enables brazed joints with high thermal and mechanical stability. The use of high-melting-point solder alloys improves creep resistance and reduces the probability of failure under thermal cycling. This is particularly relevant for long-life assemblies subject to high current densities and cyclic temperature stresses.
High-temperature brazing refers to brazing processes with temperatures typically exceeding 350 °C, depending on the brazing alloy used. It is used when assemblies need to withstand high thermal or mechanical stresses, for example in power electronics, electromobility or in applications with elevated operating temperatures and long service life requirements.
