The new SWF with MFC has been specially developed for high-precision micro soldering applications where conventional wire feed systems reach their physical limits. The SWF enables reliable, controlled feeding of solder wire with diameters down to 0.1 mm and below, without wire kinking, jamming or uncontrolled deflection on the surface.
A key feature of the system is its force detection capability, which is up to 100 times more accurate, allowing forces as small as 0.1 N to be reliably detected. This highly sensitive force measurement enables safe and reproducible contact detection even for the smallest solder joints. The solder wire is guided precisely to the surface without being mechanically overloaded or deflecting sideways. This represents a decisive advantage for delicate solder pads, complex geometries, and high-density assemblies.
The Sensitive Wire Feeder shows its full potential particularly in combination with temperature-controlled laser soldering. Process results prove that even smaller solder pads and finer solder joints can be reliably soldered with the new SWF than was previously possible. The system therefore opens up new process windows for applications in power electronics, photonics, sensor technology, medical technology and microelectronics. The results to date clearly show that the Sensitive Wire Feeder significantly increases process reliability, precision and repeatability in micro soldering, especially where maximum control over wire force and wire position is required.
"I am your contact person"
Sales management
EN 
DE