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Thermode soldering / Bar soldering

Process-safe thermode/iron soldering
EUTECT thermode soldering or bar soldering is the only system in the world with a definable and µ-precise penetration path Because of that thermode soldering in electronics production is an ideal solution for high process reliability.

Benefit

The thermode soldering process enables you to process flexible foils, cable strands and ribbon cables as well as specific SMD components. You achieve high quality results and reproducibility in the soldering process.

Performance

Force, resetting distance and temperature are controlled, visualised and recorded via an HMI control unit. This gives your overall process performance the best possible availability and traceability.

Modularity

You can integrate the modular thermode soldering system into stand-alone or inline processes. The application-specific thermode geometries are protected by automatic capton feeders and keep your process stable.

Advantages of thermode soldering

A major advantage of this soldering process is the high process stability and exact repeatability, which is for example crucial for wire harness soldering. Thanks to the precise control of temperature, penetration path and contact pressure, it is possible to produce solder joints of consistent quality and reduce rejects. Thanks to its modular design, this soldering process can be flexibly adapted to different production requirements and integrated either as a stand-alone solution or in automated production lines.

Product highlights

  • High energy efficiency
  • Temperature-force-displacement control
  • µ-precise sinking distance
  • Freely definable energy input
  • Redundant temperature measurement
  • 100% traceability
  • Cycle time optimisation of up to 70%
  • Short set-up times
  • Minimized solder consumption
  • Low maintenance effort
  • Specific thermode geometries
  • Thermode feed through intelligent linear axes
  • Contact pressure is displayed in steps of 0.5 N
  • Integrated Kapton belt module
  • Rapid heat input
  • Fast, integrated thermode cooling
  • Leading and trailing hold-down device
  • Maximum service life
  • Minimal footprint
  • Immediate system and process availability

Basics of thermode and bar soldering

Thermode and bar soldering is based on the principle of heat application using a heating tip (thermode), which is placed precisely on the materials to be soldered. The direct contact between the heating tip and the soldering material allows the necessary heat to be applied to melt the solder. The main difference to other soldering processes is that only specific areas can be heated. This is particularly important if neighbouring components or areas are to remain unaffected by the heating.

Environmental and cost benefits

In addition to the technical advantages, thermode and bar soldering also offers ecological and economic benefits. The precise use of heat and solder minimises material consumption and ensures high energy efficiency. In addition, the set-up times for changing over to different components and soldering tasks are extremely short, which increases production flexibility and reduces costs.

As EUTECT's systems have a modular design, they can be easily integrated into existing production systems and adapted to new requirements.

Precise control and process monitoring

A key feature of EUTECT thermode and iron soldering is the ability to precisely monitor and control the entire process. EUTECT systems offer comprehensive control options for the temperature, contact pressure and penetration path of the soldering tools. As the entire soldering process therefore takes place under perfect conditions, mechanically stable and electrically reliable connections are created.

In addition, all relevant process parameters can be recorded and documented in real time. This is particularly important when complete traceability of the manufacturing steps is required. For example, in the automotive or medical technology industries. Thanks to this comprehensive process monitoring, sources of error can be quickly recognised and rectified, further increasing production reliability.

Product video
Thermode module
TL-XS-800

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FAQs

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thermode soldering is a selective soldering process in which the required heat is transferred directly to the solder joint via a heated tool, known as a thermode. In this process, the components to be joined are positioned precisely and heated locally until the solder melts. Reproducible solder joints can be produced through the precise control of temperature, force and travel.

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Soldering with a soldering iron is a term for the thermode soldering. In this process, a heated thermode is placed on the components to be joined, and the heat is transferred through direct contact. The process is particularly suitable for soldering tasks where several contact points are to be soldered simultaneously or where defined areas are to be soldered in a reproducible manner.

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thermode soldering It is particularly suitable for soldering flexible films, ribbon cables, stranded wires and certain SMD components. Typical applications include any situation where precise localised heat application, defined contact pressures and a high degree of repeatability are required.

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Among the key benefits of the Thermal brazing These include high process stability and reproducibility, as well as precise control of the soldering process. Temperature, force and travel can be monitored and documented. This ensures consistent quality of the soldered joints whilst reducing the risk of rejects.

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Among the most important process parameters of the Thermal brazing These include temperature, contact pressure, penetration or settlement distance, and process time. The interaction of these parameters influences the heat input, the melting of the solder, and the mechanical and electrical quality of the solder joint. At EUTECT, these parameters are controlled, visualised and recorded.

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The sink-in or follow-through stroke describes the movement of the soldering tip during the soldering process. A precisely defined stroke allows for controlled alignment of the materials to be joined whilst the solder is melting. The EUTECT Thermal Soldering System This allows the deflection to be defined with µ-level precision.

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