E-ssembly by Beckhoff XPlanar
Automation for the inline production of today and tomorrow
Innovation
The digitalisation of mechanics for the assembly transport of tomorrow
Floating product transport using XPlanar from Beckhoff, which we have realised in our E-ssembly concept, opens up completely new possibilities for handling products inside and outside the machines as well as between the individual process steps. This means that we can look at inline production in a completely new way and this has opened up possibilities that cannot be realised with conventional belt transport systems.
We have broken new ground with this new concept of assembly transport. I am convinced that the future of inline production does not lie solely in conventional conveyor systems. We have successfully opened a door here.
Matthias Fehrenbach, CEO
Why did the EUTECT GmbH eccept the challenge of integration of the XPlanar in an inline production?
Is the automation with the XPlanar the future in inline production?
How does the XPlanar change the assembly transport between processes?
What cost optimisation is offered by the use of XPlanar?
How flexible and sustainable can the XPlanar be used?
What advantages does the XPlanar offer in terms of service and maintenance?
The E-ssembly-Line
Five processes, one system
The E-ssembly line, based on the XPlanar planar motor system from Beckoff, was developed by Eutect for soldering the bus contacts on the terminal modules used in all IP20 I/O and fieldbus systems from Beckhoff Automation GmbH & Co. KG.
The soldering system consists of two loading systems including a palletising unit, an optical position correction, a laser cell with three laser soldering heads and a final loading system with palletiser. The entire assembly transport takes place via the integrated XPlanar planar motor system from Beckhoff.
Process 1
Precise loading of workpiece carriers
In the first step of this system concept, a plug is removed from the pallet using a pick & place system, rotated into position and placed in the workpiece carrier mounted on the XPlanar.
Process 2
Force-displacement-controlled pressing of connectors into the assemblies
In the subsequent second pick & place system, the assembly is also removed from a pallet and pressed into the connector, which is positioned in the workpiece carrier on the XPlanar, in a force-displacement-controlled manner.
Process 3
Reliable position correction
A camera then checks the position of the connector and assembly in the workpiece carrier. If the position is incorrect, the XPlanar with the assembled workpiece carrier does not enter the subsequent soldering system.
Process 4
3-fold laser soldering
Three loaded movers enter the laser soldering system simultaneously, in which the connectors and assemblies on all movers are soldered in a single process step. XPlanar tiles were also integrated into the laser soldering system.
The assemblies remain on the XPlanar for the actual soldering process. The high-precision X-Y-Z positioning is generated by the XPlanar Mover. Once all assemblies have been soldered, they leave the system at the same time and the next assemblies move in.
Process 5
Unloading using the pick & place function
In the final work step, the finished assemblies are removed from the workpiece carrier using a pick & place system and placed on a pallet. Both the pallet feed with connectors and assemblies and the removal of full pallets are also fully automated.
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