Integrated flux application is possible in every process cell and, depending on the application process, can also be carried out independently of the position. Precise wetting of the relevant assembly areas is guaranteed with every application process.
Efficient, clean, cycle time-optimised and reproducible flux application is guaranteed by the flux modules from EUTECT.
EUTECT has the right flux application process for every soldering process, every assembly geometry and for all components used.
The non-contact, cycle time-optimised flux application using an inject flux head can be carried out from all directions and is independent of the position or installation situation. The flux points can be parameterised in terms of quantity and position using an intuitive visualisation system. Subsequent insertion of new points is also possible intuitively and without great effort via product visualisation. Process reliability during inject fluxing is guaranteed by optical sensors. This means that quantity and position-monitored inject fluxing can be offered. This results in a reproducible flux application that can be varied at specific points or over a wide area and logged using production data acquisition (PDA).
Brush fluxing enables very precise preparation of the process area with an area-wide application. It is possible to wet several flux points in parallel without splashing using several brushes, reproducibly and with optimised cycle times. This process is used from flux point diameters of 1.5 mm. The contact method allows a high proportion of solids to be applied.
Lift-dip fluxing is a suitable application method for all flux types. A reproducible wetting height can also be achieved with fluxes with a high solids content: the scoops are moved to a defined height on the product using a lifting unit. The overflow of the scoops determines the height of the flux. The flux is pumped through a circuit, any increase in the solids content is detected via density measurements and signalled to the operator. During downtimes, the flux is automatically covered to prevent the flux from evaporating quickly and the scoops from drying out.
Defined areas on the assembly can be wetted with a flux using a spray module. The application is contactless and very precise. The spray fluxer can draw the flux directly from the canister or a connected container.
Under Fluxing This refers to the targeted application of flux to those areas of an assembly or component that are subsequently to be soldered. The flux aids the soldering process by reducing oxide layers or preventing their reformation during soldering, thereby ensuring reliable wetting by the solder. In selective soldering, the flux is applied as precisely and reproducibly as possible only where it is required for the subsequent process.
The quantity and position of the flux influence the quality and reproducibility of the subsequent soldering process. Controlled application ensures that the relevant process areas are sufficiently wetted, whilst avoiding unnecessary flux application to adjacent areas of the assembly. At the same time, this helps to reduce flux consumption, contamination and process variations.
EUTECT offers a range of processes for the selective flux application These include high-precision injection fluxing, splash-free brush fluxing, lift-and-dip fluxing and space-efficient spray fluxing. The choice of suitable process depends, amongst other things, on the assembly geometry, the flux, the required application quantity, the surface area and the required cycle time.
At the Injection fluxes The flux is applied contact-free to the designated process points via an injection flux head. With EUTECT, the flux can be applied from different directions, regardless of the orientation. The quantity and position of the individual flux points can be configured, and the application monitored using optical sensors. This enables reproducible and documentable flux application.
Injection fluxes It is particularly suitable for applications where flux needs to be applied in a highly precise, reproducible manner, optimised for cycle time. Individual flux points can be defined and monitored. Furthermore, process data can be logged via the production data acquisition system, thereby enabling the flux application to be integrated into the quality assurance and traceability of the soldering process.
Brush-flushing It is suitable for the precise and comprehensive application of flux, and in particular for applications involving flux with a higher solids content. The contact method enables splash-free application with EUTECT. Several brushes can be used in parallel to wet multiple process points in a reproducible manner whilst optimising cycle times.
