Induction pumps are based on the principle of electromagnetic induction and set conductive liquids, in our case liquid solder, in motion. They generate a flow using electromagnetic fields and they do not require moving mechanical parts to transport solder. Our induction pump can be horizontally installed in our soldering modules, which significantly reduces the risk of damage and the amount of contamination particles from the solder joints that can accumulate in the induction pump. The electromagnetic drive conveys the solder to the solder nozzle without any mechanical parts in the solder. This makes our induction pump particularly low-maintenance and easy to service. The EUTECT induction pump also works reliably in high-temperature applications up to 475°C.
Outside of electronics manufacturing, our induction pump can be used to transport conductive fluids in metallurgy and liquid metals, nuclear technology, the chemical industry, electroplating, cooling and heating regulation, and in battery and fuel cell applications.