Lift-dip matrix soldering stamp

The matrix soldering stamp is the lift-dip mechanism for the lift-dip soldering system.

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The matrix soldering stamp is the lift-dip mechanism for the lift-dip soldering system.

The lift-dip soldering system is a solder bath with a temperature of max. 450°C. The areas to be soldered are immersed in a molten solder alloy. The areas to be soldered are immersed in a molten solder alloy. High-performance thermal jaws keep the liquid solder constant at a defined solder temperature. This can be kept at ±2.5°C by means of solder temperature control.

The solder bath is equipped with a servo-motorised squeegee, as well as a sensor- and pressure-monitored inert gas process control (nitrogen) and an automatic solder bath level control. Specific solder bath covers ensure minimal oxidation and maximum accessibility.

With the Flex nozzle, flexible nozzle insertion allows it to be adapted to the process. Since the position of the component to be soldered can sometimes vary from the customer’s design, the nozzle concept must be flexibly constructed.

In order to save costs and time, EUTECT developed the Flex nozzle, where the nozzle inserts can be changed at any time. The inserts are in a fixed frame and can be changed there by hand if, for example, the number of pins to be soldered changes. In this case, individual nozzles can be set “blind”. To do this, the solder flow must be briefly interrupted by switching off the pump.

Flex nozzle module with three nozzle outlets
Flex nozzle module with two nozzle outlets

With the ring nozzle, the solder flow is arranged in a circle. This allows, for example, wires that are arranged in a circle, as in enamelled copper wire soldering, to be processed simultaneously.

For a reproducible process, the nozzle is equipped with a defined solder flow and a ceramic-coated, non-wettable surface.

Ring nozzle

With the linear nozzle, larger process areas can be soldered simultaneously, which optimises the overall process cycle time. The width of the solder wave is defined by the nozzle design.

For a reproducible process, the nozzle is provided with a defined solder flow and a ceramic-coated, non-wettable surface. Solder nozzles are an essential part of the miniwave soldering process. Due to their design, solder nozzles flush the liquid solder to the designated soldering point. This concentrated, height-controlled solder flow minimises the heat load on neighbouring components and optimises the cycle time.

Further added product value:

  • Individual nozzle geometries
  • Long service life
  • Optimum cycle time
  • Maximum solder joint quality
  • Flex nozzle technology
  • Pressure mask technology
  • Flexible nitrogen mask technology
  • Low maintenance
  • Integrated nitrogen supply
  • Definable solder reflow
  • Constant, laminar solder flow
  • Minimised solder bead risk
Linear nozzle
Solder wave in linear nozzle

The double spot nozzle is used in the miniwave soldering process, in which the liquid solder is conveyed by a pump.

For a reproducible process, the nozzle is provided with a defined solder flow and a ceramic-coated, non-wettable surface. Solder nozzles are an essential part of the miniwave soldering process. Due to their design, solder nozzles flush the liquid solder to the designated soldering point. This concentrated, height-controlled solder flow minimises the heat load on neighbouring components and optimises the cycle time.

Further added product value:

  • Individual nozzle geometries
  • Long service life
  • Optimum cycle time
  • Maximum solder joint quality
  • Flex nozzle technology
  • Pressure mask technology
  • Flexible nitrogen mask technology
  • Low maintenance
  • Integrated nitrogen supply
  • Definable solder reflow
  • Constant, laminar solder flow
  • Minimised solder bead risk
Double spot nozzle

During the soldering process, the component pin is immersed in the small solder wave that emerges from the nozzle.

Solder nozzles are an essential part of the mini wave soldering process. Due to their design, solder nozzles flush the liquid solder to the designated soldering point. This concentrated, height-controlled solder flow minimises the heat load on neighbouring components and optimises the cycle time.

Further added product value:

  • Individual nozzle geometries
  • Long service life
  • Optimum cycle time
  • Maximum solder joint quality
  • Flex nozzle technology
  • Pressure mask technology
  • Flexible nitrogen mask technology
  • Low maintenance
  • Integrated nitrogen supply
  • Definable solder reflow
  • Constant, laminar solder flow
  • Minimised solder bead risk
Spot nozzle
Spot nozzle under PCB
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