Infrared heating is used to preheat the assembly before the induction soldering process.

This gently preheats the assembly, which minimises material stress during soldering. This also allows the previously applied flux to be activated, which also influences the cycle time. Furthermore, preheating prevents solder bead formation, temperature shocks for adjacent components and thus promotes an excellent soldering result.

Infrared heat can be used to gently preheat the assembly. The infrared radiator is directed at a small area of the assembly.

Since the infrared radiation does not first heat up via the room air, but acts directly on a body, the heat transfer is faster and more targeted. This means that the applied flux can be activated and the assembly substrate as well as components in the vicinity of the solder joint can also be preheated. In this way, the cycle time can also be influenced.

Furthermore, preheating prevents solder bead formation and temperature shocks for neighbouring components and thus promotes an excellent soldering result. This directly influences the through-hole plating and the formation of the counter-miniscus on the other side of the through-hole plating of the solder joint, thus optimising the soldering quality and the cycle time.

By means of infrared heat, which is generated by an infrared radiator covering a large area, the assembly can be gently preheated.

Because the infrared radiation is not first heated by the air in the room, but acts directly on a body, the heat transfer is faster and more targeted. This means that the applied flux can be activated and the assembly substrate as well as components in the vicinity of the solder joint can also be preheated. In this way, the cycle time can also be influenced.

Furthermore, preheating prevents solder bead formation and temperature shocks for neighbouring components and thus promotes an excellent soldering result. This directly influences the through-hole plating and the formation of the counter-miniscus on the other side of the through-hole plating of the solder joint, thus optimising the soldering quality and the cycle time.

By means of a matrix blower, warm air is blown to defined locations underneath an assembly, preheating it.

Preheating by means of warm air allows the previously applied flux to be activated and the assembly substrate and components in the vicinity of the solder joint to be preheated as well.

The material stress, especially for the substrate and the already soldered SMD components, triggered by the heat supply, is thus minimised. Furthermore, preheating prevents solder bead formation and thus promotes an excellent soldering result. This directly influences the through-hole plating and the formation of the counter-miniscus on the other side of the through-hole plating of the solder joint, thus optimising the soldering quality and the cycle time.

By means of a power blower, warm air is blown under the assembly, preheating it.

By preheating with warm air, the previously applied flux can be activated and the assembly substrate and components in the vicinity of the solder joint can also be preheated. This can also influence the cycle time.

Furthermore, preheating prevents solder bead formation, temperature shocks for neighbouring components and thus promotes an excellent soldering result. Thus, direct influence is taken on the through-hole plating and the formation of the counter-miniscus on the other side of the through-hole plating of the solder joint, thus optimising the soldering quality and the cycle time.

By means of convection heat, which is generated by the convection module, the assembly can be gently preheated.

By preheating with warm air, the previously applied flux can be activated and the assembly substrate and components in the vicinity of the solder joint can also be preheated. This can also influence the cycle time.

Furthermore, preheating prevents solder bead formation, temperature shocks for neighbouring components and thus promotes an excellent soldering result. This directly influences the through-hole plating and the formation of the counter-miniscus on the other side of the through-hole plating of the solder joint, thus optimising the soldering quality and the cycle time.