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Modular soldering automation
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EUTECT-Connecting technology
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- EUTECT-Automation cells
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EUTECT-Kinematics
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- EUTECT-E-ssembly
- EUTECT-Automation
- EUTECT automation platform Multiple Process Changer (MPC)
- EUTECT Traceability
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EUTECT SOLUTION COMPETENCE
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- Choosing the right selective soldering process for my end product?
- Do you have too little flux on the solder joint but too much on the circuit board?
- How can voids be avoided when soldering THT components?
- Do you have solder ball formations on the wire or the solder joint when laser soldering?
- Is preheating of assemblies unnecessary stress for components?
- Does your laser soldering cause burns on the assembly?
- Do you desolder your SMD-components during selective soldering?
- Lacking hole fill during THT-soldering?
- Wire bend? Problems with piston or laser soldering?
- Do you want to prevent solder beads?
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Solutions
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EUTECT SOLUTION COMPETENCE
+
- Choosing the right selective soldering process for my end product?
- Do you have too little flux on the solder joint but too much on the circuit board?
- How can voids be avoided when soldering THT components?
- Do you have solder ball formations on the wire or the solder joint when laser soldering?
- Is preheating of assemblies unnecessary stress for components?
- Does your laser soldering cause burns on the assembly?
- Do you desolder your SMD-components during selective soldering?
- Lacking hole fill during THT-soldering?
- Wire bend? Problems with piston or laser soldering?
- Do you want to prevent solder beads?
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- Service & Maintenance
- Service-Video
- preservation of value
- Retrofit solution
- Educational & Training Courses
- QR-Code
- Downloads
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