The use of the Laser Knife has the same process objectives as thermode soldering. The heat is transferred to the component by means of a laser.

The Laser Knife consists of a position-monitored hold-down device, which brings the two surfaces to be soldered together in a defined manner, and a laser, which is also used in the previous EUTECT laser soldering modules. The temperature is applied without contact via the laser beam. The temperature-controlled laser is equipped with an integrated pyrometer and a camera which guarantees the user maximum process stability, quality and traceability. The laser massively accelerates the soldering process without losing reproducibility and result quality. Depending on the component, the Laser Knife is 10x faster than the previous thermal mode. Energy consumption is also reduced by 70%. Furthermore, no product-specific thermode moulds and capton ribbons are necessary.

Laser soldering with and without controlled wire feeder is becoming more and more important due to the increasing miniaturisation as well as the increasing packing density and the use of various electronic components in individual assemblies.

Laser soldering is typically used when the solder joints are difficult to access or have extremely fine structures. The heat is applied quickly, without contact and with pinpoint accuracy. The process is particularly suitable when wave soldering and assembly soldering processes are unsuitable.

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